Inventor · disambiguated record
Eiji Yoshimura
Also filed as: YOSHIMURA EIJI
8 granted patents·6 pending applications·62 citations·filing 1980–2022
85Inventor score
Top patents by PatentIndex Score
14 records- 0181US9573634B2Front air-flow streamlining structure of automotive vehicleMAZDA MOTOR·Filed 2015·Granted Feb 21, 2017·5 cites·14 claims
- 0274US6555209B1Method of manufacturing multilayer wiring boardDAIWA KK·Filed 2000·Granted Apr 29, 2003·20 cites·16 claims
- 0366US7556307B2Automobile movable floor apparatusMAZDA MOTOR·Filed 2007·Granted Jul 7, 2009·10 cites·16 claims
- 0464US10770905B2Combined power generation systemKAWASAKI HEAVY IND LTD·Filed 2017·Granted Sep 8, 2020·2 cites·10 claims
- 0556US4500581AMaterial for protecting human bodies from harmful or poisonous chemical substanceTOYO BOSEKI·Filed 1982·Granted Feb 19, 1985·15 cites·21 claims
- 0651US2024147633A1Method for manufacturing wiring board or wiring board materialDAIWA KK·Filed 2022·Application pending·0 cites
- 0750US9768712B2Power conversion device connected to single-phase systemKAWASAKI HEAVY IND LTD·Filed 2015·Granted Sep 19, 2017·1 cites·13 claims
- 0845US2011272731A1Substrate for light emitting element package, and light emitting element packageDENKI KAGAKU KOGYO KK·Filed 2008·Application pending·0 cites
- 0940US2011284914A1Method for manufacturing substrate for light emitting element package, and light emitting element packageSUZUKI MOTOHIRO·Filed 2008·Application pending·0 cites
- 1040US2011311831A1Method for manufacturing substrate for light emitting element package, and light emitting element packageSUZUKI MOTOHIRO·Filed 2008·Application pending·0 cites
- 1137US2004040739A1Multilayer wiring board and method of manufacturing the sameFiled 2002·Application pending·0 cites
- 1235US4332851AReceptor sheet for electrophotographyRANK XEROX LTD·Filed 1980·Granted Jun 1, 1982·6 cites·7 claims
- 1335US2012311856A1Substrate for mounting light-emitting element and method for producing sameYOSHIMURA EIJI·Filed 2010·Application pending·0 cites
- 1430US6527963B1Method of manufacturing multilayer wiring boardsDAIWA KK·Filed 1998·Granted Mar 4, 2003·3 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →