Inventor · disambiguated record
Kam Chuan Lau
Also filed as: LAU KAM CHUAN
4 granted patents·24 citations·filing 2004–2015
70Inventor score
Top patents by PatentIndex Score
4 records- 0179US7846774B2Multiple row exposed leads for MLP high density packagesCARSEM M SDN BHD·Filed 2006·Granted Dec 7, 2010·15 cites·19 claims
- 0250US9190385B2Thin plastic leadless package with exposed metal die paddleYEE MOW LUM·Filed 2007·Granted Nov 17, 2015·1 cites·7 claims
- 0348US7351611B2Method of making the mould for encapsulating a leadframe packageCARSEM M SDN BHD·Filed 2004·Granted Apr 1, 2008·8 cites·4 claims
- 0444US9691688B2Thin plastic leadless package with exposed metal die paddleCARSEM (M) SDN BHD·Filed 2015·Granted Jun 27, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →