Inventor · disambiguated record
Kuan-Wei Chuang
Also filed as: CHUANG KUAN-WEI
5 granted patents·6 pending applications·6 citations·filing 2011–2025
68Inventor score
Top patents by PatentIndex Score
11 records- 0174US8519526B2Semiconductor package and fabrication method thereofHUANG JUNG-PANG·Filed 2011·Granted Aug 27, 2013·5 cites·6 claims
- 0272US12354885B2Electronic package, electronic structure and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·15 claims
- 0372US2025308938A1Electronic package and electronic structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0461US8895367B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 25, 2014·1 cites·10 claims
- 0560US2025273516A1Manufacturing method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0657US2025062185A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0750US9257381B2Semiconductor package, and interposer structure of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 9, 2016·0 cites·9 claims
- 0848US9548220B2Method of fabricating semiconductor package having an interposer structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 17, 2017·0 cites·14 claims
- 0940US2014127864A1Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1038US2014077387A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1132US2016079110A1Semiconductor package, carrier structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →