Inventor · disambiguated record
Jung-Pang Huang
Also filed as: HUANG JUNG-PANG
9 granted patents·5 pending applications·20 citations·filing 2011–2017
83Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD10CHANG CHIANG-CHENG2CHEN YAN-HENG1HUANG JUNG-PANG1
Top patents by PatentIndex Score
14 records- 0185US9812340B2Method of fabricating semiconductor package having semiconductor elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·14 claims
- 0280US8680692B2Carrier, semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Granted Mar 25, 2014·5 cites·3 claims
- 0378US10049955B2Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Aug 14, 2018·2 cites·7 claims
- 0474US8519526B2Semiconductor package and fabrication method thereofHUANG JUNG-PANG·Filed 2011·Granted Aug 27, 2013·5 cites·6 claims
- 0571US9324585B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 26, 2016·2 cites·5 claims
- 0661US8895367B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 25, 2014·1 cites·10 claims
- 0756US8829672B2Semiconductor package, package structure and fabrication method thereofCHEN YAN-HENG·Filed 2012·Granted Sep 9, 2014·1 cites·14 claims
- 0853US9899237B2Carrier, semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·0 cites·9 claims
- 0952US9117698B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·11 claims
- 1047US2013228915A1Semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Application pending·0 cites
- 1141US2014134797A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1239US2014183721A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1336US2014117537A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1432US2016079110A1Semiconductor package, carrier structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →