Inventor · disambiguated record
Chung-Min Tsai
Also filed as: TSAI CHUNG-MIN
9 granted patents·3 pending applications·30 citations·filing 2007–2018
84Inventor score
Files withUNITED MICROELECTRONICS CORP7NAT UNIV TSING HUA2HEWLETT PACKARD DEVELOPMENT CO1UNIV TSINGHUA1WU HSIN-WEI1
Top patents by PatentIndex Score
12 records- 0192US9397214B1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 19, 2016·10 cites·10 claims
- 0291US9780218B1Bottom-up epitaxy growth on air-gap bufferUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·8 cites·16 claims
- 0381US9496396B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 15, 2016·3 cites·13 claims
- 0477US10158022B2Bottom-up epitaxy growth on air-gap bufferUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 18, 2018·2 cites·16 claims
- 0570US8461037B2Method for fabricating interconnections with carbon nanotubesWU HSIN-WEI·Filed 2011·Granted Jun 11, 2013·3 cites·7 claims
- 0666US7858147B2Interconnect structure and method of fabricating the sameNAT UNIV TSING HUA·Filed 2008·Granted Dec 28, 2010·4 cites·11 claims
- 0752US9847393B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 19, 2017·0 cites·3 claims
- 0843US10236179B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 19, 2019·0 cites·15 claims
- 0941US8368057B2Organic thin film transistorNAT UNIV TSING HUA·Filed 2010·Granted Feb 5, 2013·0 cites·18 claims
- 1041US2021157534A1Printing content based on printing medium geometryHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 1141US2008067681A1Interconnection structure and manufacturing method thereofUNIV TSINGHUA·Filed 2007·Application pending·0 cites
- 1234US2018097110A1Method for manufacturing a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →