Inventor · disambiguated record
Shinsuke Tei
Also filed as: TEI SHINSUKE
18 granted patents·1 pending application·139 citations·filing 2006–2021
92Inventor score
Top patents by PatentIndex Score
19 records- 0197US7857190B2Wire bonding apparatus, record medium storing bonding control program, and bonding methodSHINKAWA KK·Filed 2010·Granted Dec 28, 2010·67 cites·3 claims
- 0287US7699209B2Wire bonding apparatus, record medium storing bonding control program, and bonding methodSHINKAWA KK·Filed 2006·Granted Apr 20, 2010·17 cites·9 claims
- 0385US7686204B2Wire bonding apparatus, record medium storing bonding control program, and bonding methodSHINKAWA KK·Filed 2006·Granted Mar 30, 2010·13 cites·6 claims
- 0479US11450640B2Wire bonding apparatus and manufacturing method for semiconductor apparatusSHINKAWA KK·Filed 2018·Granted Sep 20, 2022·3 cites·10 claims
- 0579US8123108B2Method of manufacturing semiconductor device and wire bonding apparatusAKIYAMA SHINICHI·Filed 2011·Granted Feb 28, 2012·5 cites·3 claims
- 0679US7934634B2Wire bonding methodSHINKAWA KK·Filed 2009·Granted May 3, 2011·8 cites·4 claims
- 0777US8815732B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2012·Granted Aug 26, 2014·4 cites·5 claims
- 0875US8191759B2Wire bonding apparatus and wire bonding methodTEI SHINSUKE·Filed 2011·Granted Jun 5, 2012·6 cites·5 claims
- 0973US8196803B2Method of manufacturing semiconductor device and wire bonding apparatusAKIYAMA SHINICHI·Filed 2011·Granted Jun 12, 2012·3 cites·3 claims
- 1071US7658314B2Tail wire cutting method and bonding apparatusSHINKAWA KK·Filed 2007·Granted Feb 9, 2010·9 cites·11 claims
- 1170US8143155B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2009·Granted Mar 27, 2012·4 cites·11 claims
- 1253US7851347B2Wire bonding method and semiconductor deviceSHINKAWA KK·Filed 2009·Granted Dec 14, 2010·0 cites·8 claims
- 1352US12107067B2Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording programSHINKAWA KK·Filed 2020·Granted Oct 1, 2024·0 cites·10 claims
- 1450US12374653B2Manufacturing method of semiconductor device and wire bonding apparatusSHINKAWA KK·Filed 2021·Granted Jul 29, 2025·0 cites·8 claims
- 1549US12107070B2Wire bonding apparatus and method for manufacturing semiconductor deviceSHINKAWA KK·Filed 2020·Granted Oct 1, 2024·0 cites·5 claims
- 1648US12374563B2Semiconductor device manufacturing methodSHINKAWA KK·Filed 2020·Granted Jul 29, 2025·0 cites·3 claims
- 1746US2006175383A1Wire bonding methodSHINKAWA KK·Filed 2006·Application pending·0 cites
- 1845US12417997B2Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor deviceSHINKAWA KK·Filed 2019·Granted Sep 16, 2025·0 cites·1 claims
- 1945US8232656B2Semiconductor deviceMII TATSUNARI·Filed 2010·Granted Jul 31, 2012·0 cites·4 claims
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