Inventor · disambiguated record
Paul F. Bodenweber
Also filed as: BODENWEBER PAUL · BODENWEBER PAUL F · BODENWEBER PAUL FRANCIS
24 granted patents·1 pending application·122 citations·filing 1996–2020
95Inventor score
Top patents by PatentIndex Score
25 records- 0194US10757833B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Aug 25, 2020·7 cites·17 claims
- 0294US9735083B1Adjustable heat sink fin spacingIBM·Filed 2016·Granted Aug 15, 2017·7 cites·8 claims
- 0394US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 0493US9366591B2Determining magnitude of compressive loadingIBM·Filed 2014·Granted Jun 14, 2016·10 cites·12 claims
- 0593US7118385B1Apparatus for implementing a self-centering land grid array socketIBM·Filed 2005·Granted Oct 10, 2006·29 cites·17 claims
- 0691US10172258B2Cooling structure for electronic boardsIBM·Filed 2017·Granted Jan 1, 2019·5 cites·10 claims
- 0787US10088244B2Adjustable heat sink fin spacingIBM·Filed 2017·Granted Oct 2, 2018·3 cites·20 claims
- 0887US9721870B2Cooling structure for electronic boardsIBM·Filed 2014·Granted Aug 1, 2017·5 cites·16 claims
- 0983US7913379B2Tool assembly for extracting and installing dual in-line memory module cardletsIBM·Filed 2008·Granted Mar 29, 2011·14 cites·17 claims
- 1081US8794079B2Determining magnitude of compressive loadingBODENWEBER PAUL F·Filed 2011·Granted Aug 5, 2014·3 cites·9 claims
- 1174US9226426B2Electronic device console with natural draft coolingBODENWEBER PAUL F·Filed 2012·Granted Dec 29, 2015·2 cites·18 claims
- 1271US10584924B2Adjustable heat sink fin spacingIBM·Filed 2017·Granted Mar 10, 2020·0 cites·5 claims
- 1370US11825592B2Electronic device console with natural draft coolingIBM·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 1468US8717043B2Determining thermal interface material (TIM) thickness changeBODENWEBER PAUL F·Filed 2011·Granted May 6, 2014·2 cites·19 claims
- 1567US11035625B2Adjustable heat sink fin spacingIBM·Filed 2019·Granted Jun 15, 2021·0 cites·10 claims
- 1666US10948247B2Adjustable heat sink fin spacingIBM·Filed 2019·Granted Mar 16, 2021·0 cites·10 claims
- 1765US10905029B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Jan 26, 2021·0 cites·12 claims
- 1861US10542636B2Cooling structure for electronic boardsIBM·Filed 2018·Granted Jan 21, 2020·0 cites·8 claims
- 1959US9921008B2Adjustable heat sink fin spacingIBM·Filed 2017·Granted Mar 20, 2018·0 cites·16 claims
- 2055US10834808B2Electronic device console with natural draft coolingIBM·Filed 2015·Granted Nov 10, 2020·0 cites·18 claims
- 2150US6281692B1Interposer for maintaining temporary contact between a substrate and a test bedIBM·Filed 1998·Granted Aug 28, 2001·15 cites·10 claims
- 2244US9105500B2Non-hermetic sealed multi-chip module packageBODENWEBER PAUL F·Filed 2012·Granted Aug 11, 2015·0 cites·14 claims
- 2337US2007054514A1Socket measurement apparatus and methodIBM·Filed 2005·Application pending·0 cites
- 2431US6984997B2Method and system for testing multi-chip integrated circuit modulesIBM·Filed 2003·Granted Jan 10, 2006·0 cites·30 claims
- 2528US5898311AShorting pad having a flexible conductive sheetIBM·Filed 1996·Granted Apr 27, 1999·4 cites·12 claims
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