Inventor · disambiguated record
Catharina Wille
Also filed as: WILLE CATHARINA
7 granted patents·6 pending applications·9 citations·filing 2017–2025
77Inventor score
Top patents by PatentIndex Score
13 records- 0196US11552042B2Solder material with two different size nickel particlesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 10, 2023·3 cites·17 claims
- 0295US12023762B2Layer structure with an intermetallic phase layer and a chip package that includes the layer structureINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 2, 2024·2 cites·22 claims
- 0393US12347805B2Inkjet printing of diffusion solderINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jul 1, 2025·2 cites·5 claims
- 0482US12330243B2Method of forming an intermetallic phase layer with a plurality of nickel particlesINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·15 claims
- 0573US10014275B2Method for producing a chip assemblageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 3, 2018·2 cites·19 claims
- 0672US2025300127A1Inkjet printing of diffusion solderINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 0765US11776927B2Semiconductor device including a solder compound containing a compound Sn/SbINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 0864US2025100088A1Solder material, layer structure, and method of forming a layer structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0962US2022355422A1Lead-free solder material, layer structure, method of forming a solder material, and method of forming a layer structureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1056US11069644B2Semiconductor device including a solder compound containing a compound Sn/SbINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·0 cites·16 claims
- 1153US2023095749A1Solder material, layer structure, chip package, method of forming a layer structure, and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1250US2023420334A1Power semiconductor module arrangement and method for forming the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1343US2020227312A1Semiconductor devices including adhesion promoting structures and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →