Inventor · disambiguated record
Kuo-Ting Lin
Also filed as: LIN KUO-TING
10 granted patents·1 pending application·34 citations·filing 2008–2018
85Inventor score
Top patents by PatentIndex Score
11 records- 0192US9761568B2Thin fan-out multi-chip stacked packages and the method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·12 cites·19 claims
- 0288US9831219B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 28, 2017·6 cites·20 claims
- 0383US9899307B2Fan-out chip package with dummy pattern and its fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Feb 20, 2018·4 cites·7 claims
- 0481US9659911B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2016·Granted May 23, 2017·3 cites·20 claims
- 0579US10304716B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·4 cites·19 claims
- 0671US9716079B2Multi-chip package having encapsulation body to replace substrate corePOWERTECH TECHNOLOGY INC·Filed 2016·Granted Jul 25, 2017·2 cites·20 claims
- 0768US9673178B2Method of forming package structure with dummy pads for bondingPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Jun 6, 2017·2 cites·7 claims
- 0864US9837384B2Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangementPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·1 cites·10 claims
- 0950US10121736B2Method of fabricating packaging layer of fan-out chip packagePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Nov 6, 2018·0 cites·8 claims
- 1036US2017186711A1Structure and method of fan-out stacked packagesPOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1132US8126100B2Communication protocol methodsLIN KUO-TING·Filed 2008·Granted Feb 28, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →