Inventor · disambiguated record
Yong-Cheng Chuang
Also filed as: CHUANG YONG-CHENG
9 granted patents·80 citations·filing 2015–2017
86Inventor score
Technology areasH10W
Files withPOWERTECH TECHNOLOGY INC9
Top patents by PatentIndex Score
9 records- 0197US9716080B1Thin fan-out multi-chip stacked package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Jul 25, 2017·37 cites·20 claims
- 0293US10128211B2Thin fan-out multi-chip stacked package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·14 cites·22 claims
- 0392US9761568B2Thin fan-out multi-chip stacked packages and the method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·12 cites·19 claims
- 0488US9831219B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 28, 2017·6 cites·20 claims
- 0581US9659911B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2016·Granted May 23, 2017·3 cites·20 claims
- 0679US10304716B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·4 cites·19 claims
- 0771US9859187B2Ball grid array package with protective circuitry layout and a substrate utilized in the packagePOWERTECH TECHNOLOGY INC·Filed 2016·Granted Jan 2, 2018·2 cites·16 claims
- 0868US9673178B2Method of forming package structure with dummy pads for bondingPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Jun 6, 2017·2 cites·7 claims
- 0927US10079222B2Package-on-package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Sep 18, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →