Inventor · disambiguated record
Philippe Soussan
Also filed as: SOUSSAN PHILIPPE
13 granted patents·5 pending applications·27 citations·filing 2006–2023
86Inventor score
Top patents by PatentIndex Score
18 records- 0180US8294976B1Method for reducing substrate chargingDE WOLF INGRID·Filed 2009·Granted Oct 23, 2012·13 cites·14 claims
- 0276US9929206B2Integrated circuit and method for manufacturing integrated circuitIMEC VZW·Filed 2016·Granted Mar 27, 2018·4 cites·20 claims
- 0375US10481348B2Optical system for coupling light into a waveguidemiDiagnostics NV·Filed 2017·Granted Nov 19, 2019·3 cites·13 claims
- 0475US10128123B2Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing sameIMEC VZW·Filed 2016·Granted Nov 13, 2018·3 cites·13 claims
- 0565US2023378720A1Vertical laser emitter and manufacturing method thereofIMEC VZW·Filed 2023·Application pending·0 cites
- 0664US9048198B2Biocompatible packagingOP DE BEECK MARIA·Filed 2011·Granted Jun 2, 2015·3 cites·20 claims
- 0759US2024207845A1Microfluidic device and a method for manufacturing a microfluidic deviceIMEC VZW·Filed 2023·Application pending·0 cites
- 0856US2021384700A1Method for Processing a Laser DeviceIMEC VZW·Filed 2021·Application pending·0 cites
- 0955US12374675B2Method of producing hybrid semiconductor waferIMEC VZW·Filed 2022·Granted Jul 29, 2025·0 cites·22 claims
- 1049US8440504B2Method for aligning and bonding elements and a device comprising aligned and bonded elementsSOUSSAN PHILIPPE·Filed 2008·Granted May 14, 2013·1 cites·22 claims
- 1148US10271796B2Biocompatible packagingIMEC·Filed 2015·Granted Apr 30, 2019·0 cites·12 claims
- 1245US11282702B2Method of forming a semiconductor device structureIMEC VZW·Filed 2020·Granted Mar 22, 2022·0 cites·11 claims
- 1344US9000588B2Method for self-assembly of substrates and devices obtained thereofIMEC·Filed 2013·Granted Apr 7, 2015·0 cites·15 claims
- 1437US2007071900A1Methods for protecting metal surfacesSOUSSAN PHILIPPE·Filed 2006·Application pending·0 cites
- 1536US9105621B2Method for bonding of group III-nitride device-on-silicon and devices obtained thereofIMEC·Filed 2013·Granted Aug 11, 2015·0 cites·14 claims
- 1633US2010264538A1Method for producing electrical interconnects and devices made thereofIMEC·Filed 2010·Application pending·0 cites
- 1732US8822330B2Method for providing oxide layersSOUSSAN PHILIPPE·Filed 2010·Granted Sep 2, 2014·0 cites·17 claims
- 1827US9061897B2Methods for embedding conducting material and devices resulting from said methodsPHOMMAHAXAY ALAIN·Filed 2011·Granted Jun 23, 2015·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →