Inventor · disambiguated record
Laure Elisa Carbonell
Also filed as: CARBONELL LAURE ELISA
2 granted patents·299 citations·filing 2005–2013
63Inventor score
Top patents by PatentIndex Score
2 records- 0195US7338896B2Formation of deep via airgaps for three dimensional wafer to wafer interconnectIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Mar 4, 2008·299 cites·29 claims
- 0241US9997458B2Method for manufacturing germamde interconnect structures and corresponding interconnect structuresIMEC VZW·Filed 2013·Granted Jun 12, 2018·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →