Inventor · disambiguated record
Eddy Kunnen
Also filed as: KUNNEN EDDY
8 granted patents·382 citations·filing 2004–2018
86Inventor score
Top patents by PatentIndex Score
8 records- 0195US7338896B2Formation of deep via airgaps for three dimensional wafer to wafer interconnectIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Mar 4, 2008·299 cites·29 claims
- 0294US7400024B2Formation of deep trench airgaps and related applicationsIMEC INTER UNI MICRO ELECTR·Filed 2006·Granted Jul 15, 2008·48 cites·18 claims
- 0392US7396732B2Formation of deep trench airgaps and related applicationsIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Jul 8, 2008·29 cites·27 claims
- 0474US7060587B2Method for forming macropores in a layer and products obtained thereofIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Jun 13, 2006·6 cites·24 claims
- 0555US10768138B2Protecting a substrate region during fabrication of a FET sensorIMEC VZW·Filed 2018·Granted Sep 8, 2020·0 cites·16 claims
- 0648US9502264B2Method for selective oxide removalIMEC VZW·Filed 2015·Granted Nov 22, 2016·0 cites·14 claims
- 0736US7566919B2Method to reduce seedlayer topography in BICMOS processNXP BV·Filed 2004·Granted Jul 28, 2009·0 cites·20 claims
- 0827US10128124B2Method for blocking a trench portionIMEC VZW·Filed 2015·Granted Nov 13, 2018·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Eddy Kunnen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →