Inventor · disambiguated record

Yasunao Kai

Also filed as: KAI YASUNAO

2 granted patents·14 citations·filing 1996–2002

56Inventor score

Technology areasC08L H10W

Files withNIPPON TUNGSTEN2

Top patents by PatentIndex Score

2 records

0155US7304105B2High-density composite materialNIPPON TUNGSTEN·Filed 2002·Granted Dec 4, 2007·3 cites·11 claims
0236US5886269ASubstrate and heat sink for a semiconductor and method of manufacturing the sameNIPPON TUNGSTEN·Filed 1996·Granted Mar 23, 1999·11 cites·4 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →