Inventor · disambiguated record
Jun Hyeon Kim
Also filed as: KIM JUN HYEON
9 granted patents·2 pending applications·16 citations·filing 2013–2023
81Inventor score
Files withSAMSUNG ELECTRO MECH11
Top patents by PatentIndex Score
11 records- 0196US11393633B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 19, 2022·5 cites·29 claims
- 0294US11189424B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 30, 2021·3 cites·19 claims
- 0393US11574773B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 7, 2023·5 cites·12 claims
- 0487US10770230B2Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 8, 2020·3 cites·23 claims
- 0582US12148574B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2023·Granted Nov 19, 2024·0 cites·11 claims
- 0677US11784005B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0773US11735364B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 22, 2023·0 cites·25 claims
- 0851US11562859B2MLCC module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 24, 2023·0 cites·23 claims
- 0949US11183331B2MLCC module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 23, 2021·0 cites·23 claims
- 1049US2014377544A1Composite material, method for preparing thereof, and substrate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1135US2017094786A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →