Inventor · disambiguated record
Jae-Kul Lee
Also filed as: LEE JAE-KUL
17 granted patents·3 pending applications·95 citations·filing 2004–2019
91Inventor score
Files withSAMSUNG ELECTRO MECH10SAMSUNG ELECTRONICS CO LTD5HAN KYUNG-JIN2JEONG JIN-SOO1KI HYUN-SEUNG1
Top patents by PatentIndex Score
20 records- 0193US8633397B2Method of processing cavity of core substrateJEONG JIN-SOO·Filed 2010·Granted Jan 21, 2014·40 cites·11 claims
- 0288US7947906B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted May 24, 2011·19 cites·15 claims
- 0387US10615212B2Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 7, 2020·6 cites·21 claims
- 0485US8284562B2Electro device embedded printed circuit board and manufacturing method thereofLEE DOO-HWAN·Filed 2010·Granted Oct 9, 2012·10 cites·12 claims
- 0580US10629641B2Fan-out sensor package and optical-type fingerprint sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 21, 2020·3 cites·18 claims
- 0679US10748828B2Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 18, 2020·3 cites·11 claims
- 0775US10847476B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·2 cites·20 claims
- 0866US10741498B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·2 cites·16 claims
- 0962US8011086B2Method of manufacturing a component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Sep 6, 2011·2 cites·5 claims
- 1058US7812465B2Semiconductor chip having alignment mark and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 12, 2010·1 cites·8 claims
- 1158US7394249B2Printed circuit board with weak magnetic field sensorSAMSUNG ELECTRO MECH·Filed 2004·Granted Jul 1, 2008·7 cites·9 claims
- 1256US9035196B2Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 19, 2015·0 cites·6 claims
- 1354US9907182B2Method of manufacturing insulation film and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 27, 2018·0 cites·15 claims
- 1451US2014123486A1Method of processing cavity of core substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1548US8929091B2Method of manufacturing a printed circuit board (PCB)HAN KYUNG-JIN·Filed 2011·Granted Jan 6, 2015·0 cites·3 claims
- 1647US8184448B2Bare chip embedded PCBHAN KYUNG-JIN·Filed 2007·Granted May 22, 2012·0 cites·4 claims
- 1743US10692791B2Electronic component package with electromagnetic wave shieldingSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1839US10438927B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·0 cites·20 claims
- 1937US2006255670A1Eccentric rotor and vibration motor having the rotorKI HYUN-SEUNG·Filed 2005·Application pending·0 cites
- 2037US2016055964A1Common mode filter and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →