Inventor · disambiguated record
Ti Ching Shian
Also filed as: SHIAN TI CHING
4 granted patents·138 citations·filing 2005–2009
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0197US7285849B2Semiconductor die package using leadframe and clip and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Oct 23, 2007·114 cites·20 claims
- 0285US7638861B2Flip chip MLP with conductive inkFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Dec 29, 2009·14 cites·8 claims
- 0378US8058107B2Semiconductor die package using leadframe and clip and method of manufacturingCRUZ ERWIN VICTOR R·Filed 2007·Granted Nov 15, 2011·10 cites·22 claims
- 0447US9147627B2Flip chip MLP with conductive inkCHOI SEUNG-YONG·Filed 2009·Granted Sep 29, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →