Inventor · disambiguated record
Ercan Adem
Also filed as: ADEM ERCAN
15 granted patents·1 pending application·470 citations·filing 1998–2005
95Inventor score
Top patents by PatentIndex Score
16 records- 0195US6562718B1Process for forming fully silicided gatesADVANCED MICRO DEVICES INC·Filed 2000·Granted May 13, 2003·107 cites·18 claims
- 0293US7361586B2Preamorphization to minimize void formationSPANSION LLC·Filed 2005·Granted Apr 22, 2008·27 cites·20 claims
- 0392US6281559B1Gate stack structure for variable threshold voltageADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·107 cites·20 claims
- 0487US6667070B1Method of in situ monitoring of thickness and composition of deposited films using raman spectroscopyADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 23, 2003·31 cites·8 claims
- 0583US6383925B1Method of improving adhesion of capping layers to cooper interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·35 cites·10 claims
- 0680US6521529B1HDP treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 18, 2003·27 cites·19 claims
- 0775US7115498B1Method of ultra-low energy ion implantation to form alloy layers in copperADVANCED MICRO DEVICES INC·Filed 2004·Granted Oct 3, 2006·22 cites·17 claims
- 0874US6869878B1Method of forming a selective barrier layer using a sacrificial layerADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 22, 2005·20 cites·25 claims
- 0973US6583070B1Semiconductor device having a low dielectric constant materialADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 24, 2003·17 cites·8 claims
- 1072US7468296B1Thin film germanium diode with low reverse breakdownSPANSION LLC·Filed 2005·Granted Dec 23, 2008·4 cites·18 claims
- 1172US6641747B1Method and apparatus for determining an etch endpointADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 4, 2003·9 cites·20 claims
- 1271US6605513B2Method of forming nickel silicide using a one-step rapid thermal anneal process and backend processingADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 12, 2003·16 cites·10 claims
- 1369US6208030B1Semiconductor device having a low dielectric constant materialADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 27, 2001·31 cites·4 claims
- 1465US6770559B1Method of forming wiring by implantation of seed layer materialADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·12 cites·33 claims
- 1553US6518185B1Integration scheme for non-feature-size dependent cu-alloy introductionADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 11, 2003·5 cites·12 claims
- 1636US2003219968A1Sacrificial inlay process for improved integration of porous interlevel dielectricsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →