Inventor · disambiguated record
Yie-Chuan Chiu
Also filed as: CHIU YIE-CHUAN
4 granted patents·3 pending applications·19 citations·filing 2011–2013
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0183US8692390B2Pyramid bump structureWU CHIH-HUNG·Filed 2011·Granted Apr 8, 2014·10 cites·6 claims
- 0273US8415243B1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Granted Apr 9, 2013·4 cites·7 claims
- 0371US8658528B2Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Feb 25, 2014·3 cites·8 claims
- 0461US8450049B2Process for forming an anti-oxidant metal layer on an electronic deviceKUO CHIH-MING·Filed 2011·Granted May 28, 2013·2 cites·13 claims
- 0546US2013181346A1Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0644US2013193570A1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 0735US2013183823A1Bumping processKUO CHIH-MING·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →