Inventor · disambiguated record
Laura A. Principe
Also filed as: PRINCIPE LAURA · PRINCIPE LAURA A
2 granted patents·2 pending applications·4 citations·filing 2002–2013
44Inventor score
Top patents by PatentIndex Score
4 records- 0175US8623699B2Method of chip package build-upMCCONNELEE PAUL ALAN·Filed 2010·Granted Jan 7, 2014·4 cites·14 claims
- 0250US8829690B2System of chip package build-upGEN ELECTRIC·Filed 2013·Granted Sep 9, 2014·0 cites·14 claims
- 0339US2004049980A1Cohesive polymer plug for use in plant productionFiled 2002·Application pending·0 cites
- 0439US2004045217A1Cohesive soil plugs for use in plant productionFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →