Inventor · disambiguated record
Tae Sung Jeong
Also filed as: JEONG TAE SUNG
36 granted patents·14 pending applications·488 citations·filing 1989–2023
97Inventor score
Files withSAMSUNG ELECTRO MECH18SAMSUNG ELECTRONICS CO LTD13JEONG TAE SUNG4LEE DOO HWAN3KIM HONG WON2
Top patents by PatentIndex Score
50 records- 0196US10665535B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 26, 2020·17 cites·22 claims
- 0294US8017437B2Method for manufacturing a semiconductor packageSAMSUNG ELECTRO & MDASH MECHANICS CO LTD·Filed 2009·Granted Sep 13, 2011·45 cites·8 claims
- 0393US8893380B2Method of manufacturing a chip embedded printed circuit boardKIM HONG WON·Filed 2009·Granted Nov 25, 2014·37 cites·9 claims
- 0493US6060778ABall grid array packageHYUNDAI ELECTRONICS IND·Filed 1998·Granted May 9, 2000·252 cites·8 claims
- 0589US7642656B2Semiconductor package and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 5, 2010·15 cites·7 claims
- 0688US11189552B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 0787US10340153B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 2, 2019·6 cites·15 claims
- 0887US10048118B2Sensor package having a transparent covering member supported by electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 14, 2018·5 cites·19 claims
- 0986US10431615B2Fan-out sensor package and camera module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 1, 2019·4 cites·20 claims
- 1085US10298199B2Acoustic wave device and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted May 21, 2019·4 cites·18 claims
- 1185US10164602B2Acoustic wave device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 25, 2018·5 cites·16 claims
- 1283US10438884B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·3 cites·14 claims
- 1382US10340234B2Substrate having embedded electronic componentSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 2, 2019·3 cites·18 claims
- 1481US8692391B2Embedded ball grid array substrate and manufacturing method thereofJEONG TAE SUNG·Filed 2010·Granted Apr 8, 2014·6 cites·3 claims
- 1580US7875497B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·4 claims
- 1680US7875983B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·5 claims
- 1778US4988897ATTL to CMOS input buffer circuitSAMSUNG ELECTRONICS CO LTD·Filed 1989·Granted Jan 29, 1991·24 cites·43 claims
- 1873US10796997B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·17 claims
- 1973US9087837B2Semiconductor package and method of manufacturing the sameLEE DOO HWAN·Filed 2012·Granted Jul 21, 2015·2 cites·8 claims
- 2072US10580728B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 3, 2020·1 cites·23 claims
- 2171US11810848B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 2271US10790224B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·1 cites·18 claims
- 2371US8780572B2Printed circuit board having electronic componentLEE DOO HWAN·Filed 2010·Granted Jul 15, 2014·3 cites·3 claims
- 2471US8067831B2Integrated circuit package system with planar interconnectsKWON HYEOG CHAN·Filed 2005·Granted Nov 29, 2011·6 cites·20 claims
- 2569US8351215B2Method of manufacturing a chip embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 8, 2013·4 cites·8 claims
- 2668US7875966B2Stacked integrated circuit and package systemSTATS CHIPPAC LTD·Filed 2005·Granted Jan 25, 2011·3 cites·5 claims
- 2767US8871569B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 28, 2014·1 cites·20 claims
- 2866US11094623B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 2966US5095227AMOS transistor temperature detecting circuitSAMSUNG ELECTRONICS CO LTD·Filed 1989·Granted Mar 10, 1992·24 cites·18 claims
- 3062US12394703B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 3162US10580812B2Fan-out sensor package and camera module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·18 claims
- 3257US11444043B2Substrate having embedded electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 3356US8802999B2Embedded printed circuit board and manufacturing method thereofRYU JONG IN·Filed 2012·Granted Aug 12, 2014·1 cites·10 claims
- 3452US2014170815A1Embedded ball grid array substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3551US2014298648A1Electronic component-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3648US2011083891A1Electronic component-embedded printed circuit board and method of manufacturing the sameWE HONG BOK·Filed 2009·Application pending·0 cites
- 3748US2011083892A1Electronic component-embedded printed circuit board and method of manufacturing the sameWE HONG BOK·Filed 2009·Application pending·0 cites
- 3847US2010078204A1Printed circuit board including electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3944US8102043B2Stacked integrated circuit and package system and method for manufacturing thereofJEONG TAE SUNG·Filed 2011·Granted Jan 24, 2012·0 cites·13 claims
- 4043US10447411B2Acoustic wave device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 15, 2019·0 cites·17 claims
- 4143US2011127076A1Electronic component-embedded printed circuit board and method of manufacturing the sameKIM HONG WON·Filed 2010·Application pending·0 cites
- 4242US9673066B2Apparatus and method of manufacturing semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 6, 2017·0 cites·10 claims
- 4341US2013081863A1Substrate with built-in electronic component and method for manufacturing the sameLEE DOO HWAN·Filed 2012·Application pending·0 cites
- 4441US2007241441A1Multichip package systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 4541US2015216068A1Sensor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4638US2013119553A1Semiconductor package and method of manufacturing the sameJEONG TAE SUNG·Filed 2012·Application pending·0 cites
- 4737US2012160550A1Printed circuit board having embedded electronic component and method of manufacturing the sameJEONG TAE SUNG·Filed 2011·Application pending·0 cites
- 4836US2017006707A1Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 4931US2011164391A1Electronic component-embedded printed circuit board and method of manufacturing the sameSHIN YEE NA·Filed 2010·Application pending·0 cites
- 5029US2002029597A1Method for enhancing fatigue strength of gear using shotpeeningFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →