Inventor · disambiguated record
Seog Moon Choi
Also filed as: CHOI SEOG M · CHOI SEOG MOON
56 granted patents·50 pending applications·488 citations·filing 2005–2021
98Inventor score
Top patents by PatentIndex Score
106 records- 0197US7326964B2Light emitting diode package with protective function against electrostatic dischargeSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 5, 2008·72 cites·9 claims
- 0296US7547923B2Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 16, 2009·33 cites·3 claims
- 0396US7268014B2Fabrication method of light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2005·Granted Sep 11, 2007·49 cites·19 claims
- 0494US8017437B2Method for manufacturing a semiconductor packageSAMSUNG ELECTRO & MDASH MECHANICS CO LTD·Filed 2009·Granted Sep 13, 2011·45 cites·8 claims
- 0594US7453093B2LED package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 18, 2008·28 cites·9 claims
- 0693US7262440B2Light emitting diode package and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 28, 2007·25 cites·9 claims
- 0790US7816156B2Light emitting diode package and fabrication method thereofSAMSUNG LED CO LTD·Filed 2007·Granted Oct 19, 2010·19 cites·10 claims
- 0889US7642656B2Semiconductor package and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 5, 2010·15 cites·7 claims
- 0989US7566912B2Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 28, 2009·21 cites·17 claims
- 1087US8493167B2Transformer having the heat radiation functionKIM JONG MAN·Filed 2010·Granted Jul 23, 2013·7 cites·10 claims
- 1187US7649208B2Light emitting diode package including monitoring photodiodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Jan 19, 2010·19 cites·10 claims
- 1287US7582496B2LED package using Si substrate and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2005·Granted Sep 1, 2009·19 cites·18 claims
- 1386US7371603B2Method of fabricating light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Granted May 13, 2008·14 cites·9 claims
- 1482US8553417B2Heat-radiating substrate and method of manufacturing the samePARK JI HYUN·Filed 2011·Granted Oct 8, 2013·5 cites·2 claims
- 1582US8198543B2Rigid-flexible circuit board and method of manufacturing the sameKANG JUNG EUN·Filed 2009·Granted Jun 12, 2012·12 cites·17 claims
- 1681US8842438B23D power module packageKIM TAE HOON·Filed 2011·Granted Sep 23, 2014·6 cites·4 claims
- 1781US8030762B2Light emitting diode package having anodized insulation layer and fabrication method thereforSAMSUNG LED CO LTD·Filed 2007·Granted Oct 4, 2011·8 cites·5 claims
- 1880US8064215B2Semiconductor chip package and printed circuit boardCHUNG YUL-KYO·Filed 2008·Granted Nov 22, 2011·11 cites·4 claims
- 1980US7875497B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·4 claims
- 2080US7875983B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·5 claims
- 2177US8823153B2Semiconductor packageKIM TAE HOON·Filed 2012·Granted Sep 2, 2014·4 cites·19 claims
- 2276US8664755B2Power module package and method for manufacturing the sameLIM CHANG HYUN·Filed 2011·Granted Mar 4, 2014·4 cites·21 claims
- 2375US8941220B2Power module package and system module having the sameKIM KWANG SOO·Filed 2012·Granted Jan 27, 2015·4 cites·13 claims
- 2475US8299692B2Light emitting device package and method of manufacturing the sameLEE YOUNG KI·Filed 2008·Granted Oct 30, 2012·5 cites·15 claims
- 2575US8012778B2LED package and fabricating method thereofSAMSUNG LED CO LTD·Filed 2008·Granted Sep 6, 2011·5 cites·9 claims
- 2675US7696525B2Surface mounting device-type light emitting diodeSAMSUNG ELECTRO MECH·Filed 2007·Granted Apr 13, 2010·6 cites·8 claims
- 2773US8586128B2Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereofSHIN SANG HYUN·Filed 2009·Granted Nov 19, 2013·4 cites·5 claims
- 2872US8736077B2Semiconductor package substrateKIM JONG MAN·Filed 2011·Granted May 27, 2014·3 cites·10 claims
- 2971US8630097B2Power module using sintering die attach and manufacturing method thereofKIM TAE HYUN·Filed 2011·Granted Jan 14, 2014·4 cites·7 claims
- 3071US8058781B2Anodized metal substrate moduleLEE YOUNG KI·Filed 2007·Granted Nov 15, 2011·4 cites·10 claims
- 3171US7491978B2Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 17, 2009·7 cites·7 claims
- 3269US8630090B2Heat dissipation device for power conversion moduleSOHN YOUNG HO·Filed 2011·Granted Jan 14, 2014·2 cites·3 claims
- 3368US8058722B2Power semiconductor module and method of manufacturing the sameGAO SHAN·Filed 2009·Granted Nov 15, 2011·4 cites·10 claims
- 3467US8800137B2Method of manufacturing printed circuit boardKIM JIN SU·Filed 2010·Granted Aug 12, 2014·2 cites·8 claims
- 3566US9231167B2Insulation structure for high temperature conditions and manufacturing method thereofLEE YOUNG KI·Filed 2014·Granted Jan 5, 2016·0 cites·8 claims
- 3665US8315056B2Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Granted Nov 20, 2012·1 cites·10 claims
- 3765US2009095975A1Light emitting diode packageSUMSUNG ELECTO MECHANICS CO LT·Filed 2008·Application pending·0 cites
- 3863US8047693B2Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machineSAMSUNG LED CO LTD·Filed 2009·Granted Nov 1, 2011·0 cites·23 claims
- 3963US7911043B2Wafer level device package with sealing line having electroconductive pattern and method of packaging the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 22, 2011·2 cites·16 claims
- 4062US8603842B2Method of manufacturing package substrate for optical elementLIM CHANG HYUN·Filed 2012·Granted Dec 10, 2013·1 cites·8 claims
- 4162US8310023B2Light emitting diode package and fabrication method thereofPARK HO JOON·Filed 2009·Granted Nov 13, 2012·2 cites·7 claims
- 4262US7998879B2Insulation structure for high temperature conditions and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 16, 2011·1 cites·5 claims
- 4361US8242371B2Heat dissipating circuit board and method of manufacturing the sameSHIN HYE SOOK·Filed 2009·Granted Aug 14, 2012·2 cites·6 claims
- 4460US2008035948A1Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4559US10992033B1Antenna apparatusSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 27, 2021·0 cites·16 claims
- 4659US9107313B2Method of manufacturing a hybrid heat-radiating substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·5 claims
- 4759US7960806B2Sub-mount, light emitting diode package and manufacturing method thereofSAMSUNG LED CO LTD·Filed 2008·Granted Jun 14, 2011·1 cites·7 claims
- 4859US2014174940A1Heat-dissipating substrate and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4957US8686295B2Heat-dissipating substrate and fabricating method thereofLIM CHANG HYUN·Filed 2009·Granted Apr 1, 2014·0 cites·9 claims
- 5056US2014113392A1Package substrate for optical element and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
Showing the top 50 of 106 patent records by PatentIndex Score.
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