Inventor · disambiguated record
Yu-Sheng Hsieh
Also filed as: HSIEH YU-SHENG
22 granted patents·4 pending applications·70 citations·filing 2003–2024
94Inventor score
Top patents by PatentIndex Score
26 records- 0197US11855333B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0295US10157807B2Sensor packages and manufacturing mehtods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·10 cites·19 claims
- 0394US11929319B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0492US10636713B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 0589US11335666B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·16 claims
- 0688US8354729B2Gas sensor and manufacturing method thereofIND TECH RES INST·Filed 2010·Granted Jan 15, 2013·11 cites·9 claims
- 0786US12266847B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 0883US12205888B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0983US10978782B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 13, 2021·1 cites·20 claims
- 1083US8693711B2Capacitive transducer and fabrication methodHO TZONG-CHE·Filed 2009·Granted Apr 8, 2014·15 cites·15 claims
- 1182US11075159B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·2 cites·20 claims
- 1282US2024387359A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1381US10879170B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 1480US7716986B2Acoustic wave sensing device integrated with micro-channels and method for the sameIND TECH RES INST·Filed 2006·Granted May 18, 2010·8 cites·28 claims
- 1578US2024387454A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1676US11515618B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 29, 2022·0 cites·20 claims
- 1776US10504865B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
- 1874US12148735B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1972US9400224B2Pressure sensor and manufacturing method of the sameIND TECH RES INST·Filed 2014·Granted Jul 26, 2016·4 cites·14 claims
- 2071US10345147B2Optical packageIND TECH RES INST·Filed 2016·Granted Jul 9, 2019·1 cites·14 claims
- 2167US8859317B2Gas sensor and manufacturing method thereofIND TECH RES INST·Filed 2012·Granted Oct 14, 2014·2 cites·10 claims
- 2258US11127708B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2347US10183858B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·0 cites·20 claims
- 2446US2010019393A1Packaging structure for integration of microelectronics and mems devices by 3d stacking and method for manufacturing the sameIND TECH RES INST·Filed 2008·Application pending·0 cites
- 2543US2005051511A1Method for manufacturing chemical sensorsFiled 2003·Application pending·0 cites
- 2640US11137590B2Tunable optical deviceIND TECH RES INST·Filed 2016·Granted Oct 5, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →