Inventor · disambiguated record
Yuuto Ootuki
Also filed as: OOTUKI YUUTO
11 granted patents·239 citations·filing 1997–2012
91Inventor score
Technology areasH10P
Top patents by PatentIndex Score
11 records- 0193US6221118B1Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 1997·Granted Apr 24, 2001·123 cites·1 claims
- 0290US6863700B2Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 8, 2005·37 cites·17 claims
- 0388US6343976B1Abrasive, method of polishing wafer, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Feb 5, 2002·60 cites·27 claims
- 0471US8616936B2Abrasive, method of polishing target member and process for producing semiconductor deviceYOSHIDA MASATO·Filed 2012·Granted Dec 31, 2013·1 cites·17 claims
- 0571US8137159B2Abrasive, method of polishing target member and process for producing semiconductor deviceYOSHIDA MASATO·Filed 2011·Granted Mar 20, 2012·1 cites·25 claims
- 0671US7115021B2Abrasive, method of polishing target member and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2002·Granted Oct 3, 2006·8 cites·20 claims
- 0768US8162725B2Abrasive, method of polishing target member and process for producing semiconductor deviceYOSHIDA MASATO·Filed 2007·Granted Apr 24, 2012·1 cites·20 claims
- 0868US7963825B2Abrasive, method of polishing target member and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 21, 2011·1 cites·21 claims
- 0968US7871308B2Abrasive, method of polishing target member and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jan 18, 2011·1 cites·30 claims
- 1064US7708788B2Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 2004·Granted May 4, 2010·6 cites·12 claims
- 1152US7867303B2Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jan 11, 2011·0 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →