Inventor · disambiguated record
Bouwe W. Leenstra
Also filed as: LEENSTRA BOUWE W · LEENSTRA BOUWE WILLIAM
10 granted patents·2 pending applications·141 citations·filing 1995–2014
89Inventor score
Top patents by PatentIndex Score
12 records- 0187US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 0284US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 0380US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 0472US7401637B2Pressure-only molten metal valving apparatus and methodIBM·Filed 2006·Granted Jul 22, 2008·3 cites·20 claims
- 0566US6099935AApparatus for providing solder interconnections to semiconductor and electronic packaging devicesIBM·Filed 1995·Granted Aug 8, 2000·24 cites·2 claims
- 0647US9498837B2Vacuum transition for solder bump mold fillingGARANT JOHN J·Filed 2009·Granted Nov 22, 2016·0 cites·9 claims
- 0747US2016184926A1Laser ablation system including variable energy beam to minimize etch-stop material damageSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2014·Application pending·0 cites
- 0845US2009242614A1Method and tool for repositioning solder fill headIBM·Filed 2008·Application pending·0 cites
- 0943US5722579ABottom-surface-metallurgy rework process in ceramic modulesIBM·Filed 1996·Granted Mar 3, 1998·13 cites·22 claims
- 1042US5905566ALaser ablation top surface reference chuckIBM·Filed 1997·Granted May 18, 1999·10 cites·10 claims
- 1140US6149048AApparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1998·Granted Nov 21, 2000·7 cites·48 claims
- 1236US6448169B1Apparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1995·Granted Sep 10, 2002·5 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →