Inventor · disambiguated record
Yasuhide Kuroda
Also filed as: KURODA YASUHIDE
11 granted patents·2 pending applications·91 citations·filing 1987–2011
89Inventor score
Top patents by PatentIndex Score
13 records- 0185US7443279B2Coil package and bias tee packageFUJITSU LTD·Filed 2006·Granted Oct 28, 2008·14 cites·11 claims
- 0282US7527501B2Coaxial connector, connector assembly, printed circuit board and electronic apparatusFUJITSU LTD·Filed 2006·Granted May 5, 2009·9 cites·10 claims
- 0377US7360439B2Sample resistance measurement deviceFUJITSU LTD·Filed 2006·Granted Apr 22, 2008·10 cites·12 claims
- 0468US5593646AMethod for producing an exhaust gas cleaning metal carrierNIPPON YAKIN KOGYO CO LTD·Filed 1994·Granted Jan 14, 1997·23 cites·12 claims
- 0558US4790368AMethod of manufacturing thin metal sheet directly from molten metal and apparatus for manufacturing sameNIPPON YAKIN KOGYO CO LTD·Filed 1987·Granted Dec 13, 1988·9 cites·12 claims
- 0649US7004646B2Receptacle type optical transmitter and/or receiver moduleFUJITSU LTD·Filed 2003·Granted Feb 28, 2006·4 cites·15 claims
- 0749US5891248AApparatus for producing an exhaust gas cleaning metal carrierNIPPON YAKIN KOGYOCO LTD·Filed 1996·Granted Apr 6, 1999·15 cites·2 claims
- 0847US2008225500A1Printed circuit board unit and printed wiring boardFUJITSU LTD·Filed 2008·Application pending·0 cites
- 0946US7177548B2Optical moduleFUJITSU LTD·Filed 2004·Granted Feb 13, 2007·2 cites·2 claims
- 1039US9117788B2Heat sink device and method of repairing semiconductor deviceYAMAMOTO TSUYOSHI·Filed 2011·Granted Aug 25, 2015·0 cites·1 claims
- 1136US2006111065A1Electronic circuit and method of manufacturing the sameFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1233US6832049B1Optical ModuleFUJITSU LTD·Filed 1999·Granted Dec 14, 2004·4 cites·18 claims
- 1329US6282098B1Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the sameFUJITSU LTD·Filed 1999·Granted Aug 28, 2001·1 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →