Inventor · disambiguated record
Tatsunori Murata
Also filed as: MURATA TATSUNORI
25 granted patents·4 pending applications·56 citations·filing 2004–2021
94Inventor score
Files withRENESAS ELECTRONICS CORP11RENESAS TECH CORP7MURATA TATSUNORI5DOWA METALTECH CO LTD1HITACHI POWER SEMICONDUCTOR DEVICE LTD1
Top patents by PatentIndex Score
29 records- 0192US9263320B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·7 cites·15 claims
- 0280US9536776B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jan 3, 2017·2 cites·15 claims
- 0377US7772662B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 10, 2010·6 cites·17 claims
- 0476US7482650B2Method of manufacturing a semiconductor integrated circuit device having a columnar laminateRENESAS TECH CORP·Filed 2007·Granted Jan 27, 2009·6 cites·2 claims
- 0575US8089112B2Semiconductor device and manufacturing method thereofMURATA TATSUNORI·Filed 2011·Granted Jan 3, 2012·2 cites·7 claims
- 0672US9318818B2Electrical connector and manufacturing method thereofYAZAKI CORP·Filed 2014·Granted Apr 19, 2016·7 cites·14 claims
- 0768US7875539B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Jan 25, 2011·3 cites·19 claims
- 0867US7935542B2Manufacturing method of semiconductor device having memory element with protective filmRENESAS ELECTRONICS CORP·Filed 2009·Granted May 3, 2011·5 cites·8 claims
- 0964US8084373B2Manufacturing method of semiconductor device for enhancing the current drive capabilityMURATA TATSUNORI·Filed 2010·Granted Dec 27, 2011·2 cites·10 claims
- 1064US7759722B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 20, 2010·3 cites·17 claims
- 1162US8415756B2Semiconductor device and method of manufacturing the sameTSUKAMOTO KEISUKE·Filed 2010·Granted Apr 9, 2013·1 cites·13 claims
- 1262US8084343B2Semiconductor deviceYAMAGUCHI TADASHI·Filed 2010·Granted Dec 27, 2011·1 cites·20 claims
- 1360US8492847B2Semiconductor device having insulating film with increased tensile stress and manufacturing method thereofMURATA TATSUNORI·Filed 2011·Granted Jul 23, 2013·1 cites·26 claims
- 1460US8216859B2Manufacturing method of semiconductor device having memory element with protective filmMURATA TATSUNORI·Filed 2011·Granted Jul 10, 2012·2 cites·6 claims
- 1559US8685854B2Method of forming a via in a semiconductor deviceICHINOSE KAZUHITO·Filed 2011·Granted Apr 1, 2014·2 cites·12 claims
- 1657US7259052B2Manufacture of a semiconductor integrated circuit device including a pluarality of a columnar laminates having different spacing in different directionsRENESAS TECH CORP·Filed 2004·Granted Aug 21, 2007·6 cites·18 claims
- 1756US10304925B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted May 28, 2019·0 cites·18 claims
- 1854US7939871B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted May 10, 2011·0 cites·9 claims
- 1954US7306984B2Method of manufacture of a semiconductor integrated circuit device including a plurality of columnar laminates having different spacing in different directionsRENESAS TECH CORP·Filed 2007·Granted Dec 11, 2007·0 cites·6 claims
- 2052US12453121B2Semiconductor deviceHITACHI POWER SEMICONDUCTOR DEVICE LTD·Filed 2021·Granted Oct 21, 2025·0 cites·15 claims
- 2152US8901668B2Semiconductor device having insulating film with different stress levels in adjacent regions and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Dec 2, 2014·0 cites·7 claims
- 2248US2009289367A1Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 2346US9502282B2Method of semiconductor manufacture utilizing layer arrangement to improve autofocusRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 22, 2016·0 cites·15 claims
- 2446US8697509B2Semiconductor device having insulating film with different stress levels in adjacent regions and manufacturing method thereofMURATA TATSUNORI·Filed 2012·Granted Apr 15, 2014·0 cites·22 claims
- 2546US2006091451A1Semiconductor deviceRENESAS TECH CORP·Filed 2005·Application pending·0 cites
- 2641US10829862B2Tin-plated product and method for producing sameDOWA METALTECH CO LTD·Filed 2015·Granted Nov 10, 2020·0 cites·25 claims
- 2740US2007049046A1Oxide film filled structure, oxide film filling method, semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 2838US2011101431A1Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 2936US9559141B2Manufacturing method of using hydrogen plasma processing on a semiconductor waferRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 31, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →