Inventor · disambiguated record
Isao Sakamoto
Also filed as: SAKAMOTO ISAO
17 granted patents·4 pending applications·120 citations·filing 1978–2022
92Inventor score
Files withSAKAMOTO ISAO6TAMURA SEISAKUSHO KK6CANON KK1HITACHI MEDICAL CORP1JAPAN SCIENCE & TECH AGENCY1
Top patents by PatentIndex Score
21 records- 0187US7304478B2Magnetic resonance imaging apparatus provided with means for preventing closed loop circuit formation across and between inside and outside of cryostatHITACHI MEDICAL CORP·Filed 2003·Granted Dec 4, 2007·36 cites·36 claims
- 0279US8774234B2Data processing apparatus, data processing method, and computer-readable storage mediumSAKAMOTO ISAO·Filed 2010·Granted Jul 8, 2014·5 cites·16 claims
- 0374US8042727B2Heater, reflow apparatus, and solder bump forming method and apparatusTAMURA SEISAKUSHO KK·Filed 2005·Granted Oct 25, 2011·10 cites·6 claims
- 0472US8300535B2Information processing apparatus, method thereof, and storage mediumSAKAMOTO ISAO·Filed 2010·Granted Oct 30, 2012·3 cites·8 claims
- 0570US8995476B2Data processing apparatus, data processing method, and computer-readable storage mediumCANON KK·Filed 2014·Granted Mar 31, 2015·2 cites·9 claims
- 0670US8588234B2Data processing apparatus, method, and computer-readable storage medium for dynamically controlling a transmission intervalSAKAMOTO ISAO·Filed 2010·Granted Nov 19, 2013·3 cites·5 claims
- 0767US4356402AEngine generator power supply systemNIPPON ELECTRIC CO·Filed 1981·Granted Oct 26, 1982·38 cites·4 claims
- 0862US9043524B2Information processing apparatus, method thereof, and storage mediumSAKAMOTO ISAO·Filed 2012·Granted May 26, 2015·1 cites·17 claims
- 0958US11618108B2Molded solder and molded solder production methodTAMURA SEISAKUSHO KK·Filed 2019·Granted Apr 4, 2023·0 cites·8 claims
- 1054US2023166363A1Solder alloy, solder bonding material, solder paste, and semiconductor packageTAMURA SEISAKUSHO KK·Filed 2022·Application pending·0 cites
- 1150US10836000B2Flux, solder paste, and method for forming solder bumpTAMURA SEISAKUSHO KK·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 1249US7350686B2Method for supplying solderTAMURA SEISAKUSHO KK·Filed 2002·Granted Apr 1, 2008·4 cites·8 claims
- 1348US4198793AMethod of planting rod-shaped member in foundationNIPPON JIKKOU K K·Filed 1978·Granted Apr 22, 1980·7 cites·9 claims
- 1447US2023069504A1Sensor and method for manufacturing samePHC HOLDINGS CORP·Filed 2021·Application pending·0 cites
- 1544US2008035710A1Solder Composition and Solder Layer Forming Method Using the SameTAMURA SEISAKUSHO KK·Filed 2005·Application pending·0 cites
- 1642US8799536B2Data processing apparatus, data processing method and computer-readable mediumSAKAMOTO ISAO·Filed 2010·Granted Aug 5, 2014·0 cites·41 claims
- 1742US4980627ANumerically controlled apparatusMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 25, 1990·11 cites·3 claims
- 1841US9053225B2Data processing apparatus, data processing method, and storage mediumSAKAMOTO ISAO·Filed 2011·Granted Jun 9, 2015·0 cites·21 claims
- 1934US2007181218A1Solder composition and method of bump formation therewithJAPAN SCIENCE & TECH AGENCY·Filed 2005·Application pending·0 cites
- 2033US8104661B2Heating device, reflow device, heating method, and bump forming methodONOZAKI JUNICHI·Filed 2006·Granted Jan 31, 2012·0 cites·12 claims
- 2132US8954633B2Information processing apparatus, information processing method, and computer-readable storage mediumKIRIHATA DAIJI·Filed 2010·Granted Feb 10, 2015·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →