Inventor · disambiguated record
Paolo Colpani
Also filed as: COLPANI PAOLO
12 granted patents·6 pending applications·25 citations·filing 1999–2024
83Inventor score
Files withST MICROELECTRONICS SRL14CAUSIO ALESSANDRO1COLPANI PAOLO1FLEEP TECH S R L1ST MICROELECTRONICS INT NV1
Top patents by PatentIndex Score
18 records- 0177US11469194B2Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layerST MICROELECTRONICS SRL·Filed 2019·Granted Oct 11, 2022·2 cites·24 claims
- 0265US12021046B2Redistribution layer and integrated circuit including redistribution layerST MICROELECTRONICS SRL·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 0364US10790226B2Integrated electronic device with a redistribution region and a high resilience to mechanical stresses and method for its preparationST MICROELECTRONICS SRL·Filed 2018·Granted Sep 29, 2020·1 cites·20 claims
- 0463US6218265B1Process for fabricating a semiconductor non-volatile memory device with shallow trench isolation (STI)ST MICROELECTRONICS SRL·Filed 1999·Granted Apr 17, 2001·22 cites·10 claims
- 0562US2023187389A1Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuitST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 0655US11587866B2Integrated electronic device with a redistribution region and a high resilience to mechanical stresses and method for its preparationST MICROELECTRONICS SRL·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 0752US2022384371A1Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and method for electrically testing the integrated circuitST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 0852US2025118613A1Hemt transistorST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0952US2025262392A1Electronic device for counting dispensable doses from a device for dispensing doses of a medicinal, cosmetic, or other productFLEEP TECH S R L·Filed 2021·Application pending·0 cites
- 1050US9640614B2Integrated device with raised locos insulation regions and process for manufacturing such deviceST MICROELECTRONICS SRL·Filed 2014·Granted May 2, 2017·0 cites·25 claims
- 1148US2024088012A1Semiconductor package or device with sealing layerST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 1243US10593625B2Semiconductor device and a corresponding method of manufacturing semiconductor devicesST MICROELECTRONICS SRL·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 1339US10566283B2Semiconductor device and a corresponding method of manufacturing semiconductor devicesST MICROELECTRONICS SRL·Filed 2018·Granted Feb 18, 2020·0 cites·21 claims
- 1436US2019035728A1Integrated electronic device with a redistribution region and a high resilience to mechanical stressesST MICROELECTRONICS SRL·Filed 2018·Application pending·0 cites
- 1535US8338888B2Process for manufacturing an integrated device with “damascene” field insulation, and integrated device made by such processCOLPANI PAOLO·Filed 2010·Granted Dec 25, 2012·0 cites·22 claims
- 1634US8941176B2Integrated device with raised locos insulation regions and process for manufacturing such deviceCAUSIO ALESSANDRO·Filed 2010·Granted Jan 27, 2015·0 cites·17 claims
- 1733US9960131B2Method for thermo-mechanical stress reduction in semiconductor devices and corresponding deviceST MICROELECTRONICS SRL·Filed 2016·Granted May 1, 2018·0 cites·16 claims
- 1832US10141422B2Method of manufacturing a semiconductor device integrating a vertical conduction transistor, and semiconductor deviceST MICROELECTRONICS SRL·Filed 2017·Granted Nov 27, 2018·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →