Inventor · disambiguated record
Teaseog Um
Also filed as: UM TEASEOG
3 granted patents·23 citations·filing 2012–2015
67Inventor score
Top patents by PatentIndex Score
3 records- 0185US8939784B2Test socket having a housing with clamping devices to connect the housing to a floating guideSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·13 cites·20 claims
- 0284US9698117B2Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·8 cites·20 claims
- 0357US9024649B2Insert for semiconductor package and testing apparatus with the sameCHOI GUIHEUM·Filed 2012·Granted May 5, 2015·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →