Inventor · disambiguated record
Hiroko Akiyama
Also filed as: AKIYAMA HIROKO
3 granted patents·1 citations·filing 2011–2015
50Inventor score
Top patents by PatentIndex Score
3 records- 0155US9230873B2Semiconductor package resin composition and usage method thereofKAWATE KOHICHIRO·Filed 2012·Granted Jan 5, 2016·1 cites·5 claims
- 0247US9773714B2Semiconductor package resin composition and usage method thereof3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted Sep 26, 2017·0 cites·3 claims
- 0344US9333723B2Adhesive compositionAKIYAMA HIROKO·Filed 2011·Granted May 10, 2016·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →