Inventor · disambiguated record
Noritaka Fukuo
Also filed as: FUKUO NORITAKA
14 granted patents·2 pending applications·87 citations·filing 2014–2019
90Inventor score
Top patents by PatentIndex Score
16 records- 0196US10734400B1Three-dimensional memory device including bit lines between memory elements and an underlying peripheral circuit and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 4, 2020·28 cites·12 claims
- 0290US10256167B1Hydrogen diffusion barrier structures for CMOS devices and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Apr 9, 2019·22 cites·21 claims
- 0388US9177853B1Barrier layer stack for bit line air gap formationSANDISK TECHNOLOGIES INC·Filed 2014·Granted Nov 3, 2015·9 cites·20 claims
- 0487US9524904B2Early bit line air gap formationSANDISK TECHNOLOGIES INC·Filed 2014·Granted Dec 20, 2016·12 cites·26 claims
- 0582US9847249B2Buried etch stop layer for damascene bit line formationSANDISK TECHNOLOGIES LLC·Filed 2014·Granted Dec 19, 2017·5 cites·9 claims
- 0681US9391081B1Metal indentation to increase inter-metal breakdown voltageSANDISK TECHNOLOGIES INC·Filed 2015·Granted Jul 12, 2016·4 cites·20 claims
- 0776US9799527B2Double trench isolationSANDISK TECHNOLOGIES LLC·Filed 2014·Granted Oct 24, 2017·3 cites·10 claims
- 0870US9768183B2Source line formation and structureSANDISK TECHNOLOGIES LLC·Filed 2015·Granted Sep 19, 2017·2 cites·15 claims
- 0962US9401304B2Patterning method for low-k inter-metal dielectrics and associated semiconductor deviceSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jul 26, 2016·1 cites·16 claims
- 1057US9391606B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 12, 2016·1 cites·6 claims
- 1147US9666479B2Patterning method for low-k inter-metal dielectrics and associated semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2016·Granted May 30, 2017·0 cites·13 claims
- 1247US9478461B2Conductive line structure with openingsSANDISK TECHNOLOGIES INC·Filed 2014·Granted Oct 25, 2016·0 cites·21 claims
- 1346US10886366B2Semiconductor structures for peripheral circuitry having hydrogen diffusion barriers and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jan 5, 2021·0 cites·12 claims
- 1441US9607997B1Metal line with increased inter-metal breakdown voltageSANDISK TECHNOLOGIES INC·Filed 2015·Granted Mar 28, 2017·0 cites·20 claims
- 1533US2016204059A1Conductive Lines with Protective SidewallsSANDISK TECHNOLOGIES INC·Filed 2015·Application pending·0 cites
- 1631US2017025354A1Contact Plug Extension for Bit Line ConnectionSANDISK TECHNOLOGIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →