Inventor · disambiguated record
Hale Johnson
Also filed as: JOHNSON HALE · JOHNSON HALE L
18 granted patents·2 pending applications·114 citations·filing 2003–2020
93Inventor score
Files withSUSS MICROTEC LITHOGRAPHY GMBH10GEORGE GREGORY3JOHNSON HALE3SUSS MICROTEC AG2SUSS MICROTEC INC2
Top patents by PatentIndex Score
20 records- 0192US8267143B2Apparatus for mechanically debonding temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Sep 18, 2012·23 cites·11 claims
- 0290US8181688B2Apparatus for temporary wafer bonding and debondingJOHNSON HALE·Filed 2010·Granted May 22, 2012·25 cites·16 claims
- 0386US6829988B2Nanoimprinting apparatus and methodSUSS MICROTEC INC·Filed 2003·Granted Dec 14, 2004·35 cites·27 claims
- 0485US8764026B2Device for centering wafersGEORGE GREGORY·Filed 2010·Granted Jul 1, 2014·8 cites·8 claims
- 0579US9281229B2Method for thermal-slide debonding of temporary bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Mar 8, 2016·3 cites·16 claims
- 0679US7732320B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Jun 8, 2010·6 cites·33 claims
- 0778US10825705B2Apparatus, system, and method for handling aligned wafer pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2016·Granted Nov 3, 2020·2 cites·14 claims
- 0878US9837295B2Apparatus and method for semiconductor wafer leveling, force balancing and contact sensingSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Dec 5, 2017·3 cites·18 claims
- 0976US9875917B2Semiconductor bonding apparatus and related techniquesSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Jan 23, 2018·2 cites·29 claims
- 1076US8919412B2Apparatus for thermal-slide debonding of temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Dec 30, 2014·3 cites·15 claims
- 1169US11651983B2Apparatus, system, and method for handling aligned wafer pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2020·Granted May 16, 2023·0 cites·16 claims
- 1269US9859141B2Apparatus and method for aligning and centering wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Jan 2, 2018·2 cites·7 claims
- 1362US7790596B2Apparatus and method for semiconductor wafer bumping via injection molded solderSUSS MICROTEC AG·Filed 2008·Granted Sep 7, 2010·2 cites·12 claims
- 1455US10580678B2Apparatus and method for semiconductor wafer leveling, force balancing and contact sensingSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Mar 3, 2020·0 cites·3 claims
- 1554US9640418B2Apparatus, system, and method for handling aligned wafer pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2016·Granted May 2, 2017·0 cites·20 claims
- 1653US10319615B2Semiconductor bonding apparatus and related techniquesSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 1751US8088684B2Apparatus and method for semiconductor wafer bumping via injection molded solderJOHNSON HALE·Filed 2008·Granted Jan 3, 2012·0 cites·32 claims
- 1845US2010089978A1Method and apparatus for wafer bondingSUSS MICROTEC INC·Filed 2009·Application pending·0 cites
- 1944US11183401B2System and related techniques for handling aligned substrate pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Nov 23, 2021·0 cites·15 claims
- 2031US2015206783A1System amd method for substrate holdingJOHNSON HALE·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →