Inventor · disambiguated record
Yu-Chen Hsu
Also filed as: HSU YU-CHEN
24 granted patents·22 pending applications·47 citations·filing 2005–2024
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10PRIME VIEW INT CO LTD8MPI CORP7LCY CHEMICAL CORP4HSU YU-CHEN3
Top patents by PatentIndex Score
46 records- 0194US11515229B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·20 claims
- 0286US9780046B2Seal rings structures in semiconductor device interconnect layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·5 cites·20 claims
- 0386US9257412B2Stress reduction apparatusCHUANG YAO-CHUN·Filed 2012·Granted Feb 9, 2016·6 cites·16 claims
- 0481US2025087550A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0579US10436818B2Probe module having cantilever MEMS probe and method of making the sameMPI CORP·Filed 2017·Granted Oct 8, 2019·2 cites·14 claims
- 0679US9053990B2Bump interconnection techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 9, 2015·5 cites·12 claims
- 0776US12191224B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 0873US10290919B2Electronic deviceWISTRON CORP·Filed 2017·Granted May 14, 2019·2 cites·10 claims
- 0972US8797255B2Electronic-ink display panelHSU YU-CHEN·Filed 2007·Granted Aug 5, 2014·4 cites·14 claims
- 1072US7687806B2E-ink display and method for repairing the samePRIME VIEW INT CO LTD·Filed 2007·Granted Mar 30, 2010·5 cites·10 claims
- 1171US12113055B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·0 cites·20 claims
- 1271US7267472B2Light source protective structure of a backlight moduleA U OPTRONICS CORP·Filed 2005·Granted Sep 11, 2007·8 cites·16 claims
- 1369US10692848B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 23, 2020·1 cites·20 claims
- 1468US2025122367A1Polymer composite, use thereof, low dielectric resin composition, prepreg, and metal foil laminated boardLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 1567US9673184B2Packages with molding material forming stepsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·20 claims
- 1666US8970024B2Packages with molding material forming stepsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
- 1765US2023331971A1Hydrocarbon resin polymer, preparation method thereof, and composition and substrate comprising the sameLCY CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1864US11244940B2Stress reduction apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 1961US7884363B2Electronic-ink display apparatus and the manufacturing method thereofE INK HOLDINGS INC·Filed 2007·Granted Feb 8, 2011·2 cites·5 claims
- 2057US7816190B2E-ink display and method for repairing the samePRIME VIEW INT CO LTD·Filed 2007·Granted Oct 19, 2010·1 cites·4 claims
- 2154US2025101151A1Hydrocarbon resin polymer and manufacturing method thereof and substrate structureLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 2252US9293404B2Pre-applying supporting materials between bonded package componentsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·0 cites·18 claims
- 2352US2025066582A1Resin composition and manufacturing method thereof and substrate structureLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 2450US2008143640A1Electronic ink display device and active device array substratePRIME VIEW INT CO LTD·Filed 2007·Application pending·0 cites
- 2549US8643577B2Repairing method and structure of display electrodeCHIOU CHIH-CHIEN·Filed 2008·Granted Feb 4, 2014·1 cites·21 claims
- 2649US8063314B2Pin definition layout of electronic paper display screenHSU YU-CHEN·Filed 2009·Granted Nov 22, 2011·0 cites·13 claims
- 2748US10366971B2Pre-applying supporting materials between bonded package componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 30, 2019·0 cites·20 claims
- 2847US8115202B2Thin film transistor array substrate and electronic ink display deviceHSU YU-CHEN·Filed 2007·Granted Feb 14, 2012·0 cites·10 claims
- 2947US2008024427A1Electronic ink display panelPRIME VIEW INT CO LTD·Filed 2006·Application pending·0 cites
- 3046US2021390747A1Image fusion for image capture and processing systemsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 3142US2022043027A1Probe module having microelectromechanical probe and method of manufacturing the sameMPI CORP·Filed 2021·Application pending·0 cites
- 3242US2007195252A1Electronic Ink DisplayTSAI YU-CHI·Filed 2006·Application pending·0 cites
- 3342US2008043317A1E-ink display panelPRIME VIEW INT CO LTD·Filed 2007·Application pending·0 cites
- 3440US7264365B2Lamp positioning structureQUANTA DISPLAY INC·Filed 2006·Granted Sep 4, 2007·0 cites·7 claims
- 3540US2007228389A1Thin film transistor array substrate and electronic ink display devicePRIME VIEW INT CO LTD·Filed 2007·Application pending·0 cites
- 3640US2007228379A1E-ink display panel and active device array substrate thereofPRIME VIEW INT CO LTD·Filed 2007·Application pending·0 cites
- 3740US2007268637A1Active matrix devicePRIME VIEW INT CO LTD·Filed 2006·Application pending·0 cites
- 3839US2020116758A1Probe module having microelectromechanical probe and method of manufacturing the sameMPI CORP·Filed 2019·Application pending·0 cites
- 3938US2019212368A1Probe cardMPI CORP·Filed 2019·Application pending·0 cites
- 4037US12354238B2Image fusionQUALCOMM INC·Filed 2020·Granted Jul 8, 2025·0 cites·31 claims
- 4135US2019231926A1Bone graft composition with osteogenic capacityMAXIGEN BIOTECH INC·Filed 2019·Application pending·0 cites
- 4235US2024373128A1Image correction based on activity detectionQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4334US2006232738A1Active-matrix display panelLIN TUNG-LIANG·Filed 2005·Application pending·0 cites
- 4433US2018267083A1Microelectromechanical probe and probe head having the sameMPI CORP·Filed 2018·Application pending·0 cites
- 4532US2017176497A1Microelectromechanical probe, method of manufacturing the same and probe setMPI CORP·Filed 2016·Application pending·0 cites
- 4627US2015355235A1Probe and method for manufacturing the probeMPI CORP·Filed 2015·Application pending·0 cites
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