Inventor · disambiguated record
Rodel Manalac
Also filed as: MANALAC RODEL
3 granted patents·3 pending applications·12 citations·filing 2004–2011
57Inventor score
Technology areasH10W
Files withUNITED TEST & ASSEMBLY CT LTD2CASTILLO DENVER PAUL C1KOH YONG CHUAN1UNITED TEST AND ASSEMBLY TEST1UTAC UNITED TEST AND ASSEMBLY1
Top patents by PatentIndex Score
6 records- 0152US7109570B2Integrated circuit package with leadframe enhancement and method of manufacturing the sameUNITED TEST AND ASSEMBLY TEST·Filed 2004·Granted Sep 19, 2006·12 cites·6 claims
- 0244US2010102436A1Shrink package on boardUNITED TEST & ASSEMBLY CT LTD·Filed 2009·Application pending·0 cites
- 0337US8592258B2Semiconductor package and method of attaching semiconductor dies to substratesCASTILLO DENVER PAUL C·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 0437US2009165815A1Avoiding electrical shorts in packagingUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Application pending·0 cites
- 0537US2009194871A1Semiconductor package and method of attaching semiconductor dies to substratesUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
- 0627US8247272B2Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding processKOH YONG CHUAN·Filed 2009·Granted Aug 21, 2012·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Rodel Manalac files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →