Inventor · disambiguated record
Yasunari Ukita
Also filed as: UKITA YASUNARI
8 granted patents·7 pending applications·191 citations·filing 2002–2025
83Inventor score
Top patents by PatentIndex Score
15 records- 0195US7262511B2Conductive adhesive agent with ultrafine particlesTOSHIBA CORP·Filed 2005·Granted Aug 28, 2007·180 cites·10 claims
- 0275US10233557B2Electroplating method and electroplating deviceTOSHIBA KK·Filed 2016·Granted Mar 19, 2019·1 cites·5 claims
- 0367US7999281B2Optical semiconductor device and method of manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 16, 2011·4 cites·12 claims
- 0464US9451699B2Circuit board, electronic device, and method of manufacturing circuit boardTOSHIBA KK·Filed 2013·Granted Sep 20, 2016·1 cites·3 claims
- 0563US8605446B2Electronic apparatusISHIZAKI KIYOKAZU·Filed 2011·Granted Dec 10, 2013·2 cites·5 claims
- 0661US8895833B2Thermoelectric device and thermoelectric moduleUKITA YASUNARI·Filed 2010·Granted Nov 25, 2014·2 cites·12 claims
- 0757US12230841B2BatteryTOSHIBA KK·Filed 2021·Granted Feb 18, 2025·0 cites·5 claims
- 0851US2025300122A1Wire bonding apparatus and control methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0951US2025300123A1Wire bonding apparatus, operation method, and control methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1048US2025259963A1Wire bonding apparatus, control device, and control methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1144US2015054011A1Light emitting deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1243US6797530B2Semiconductor device-manufacturing method for manufacturing semiconductor devices with improved heat radiating efficiency and similar in size to semiconductor elementsTOSHIBA KK·Filed 2002·Granted Sep 28, 2004·1 cites·6 claims
- 1343US2008073794A1Semiconductor apparatus and fabrication method thereofTOSHIBA KK·Filed 2007·Application pending·0 cites
- 1430US2012063102A1Electronic Device, Circuit Board Assembly, and Semiconductor DeviceUKITA YASUNARI·Filed 2011·Application pending·0 cites
- 1521US2012250274A1Wiring Substrate and Electronic DeviceUKITA YASUNARI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →