Inventor · disambiguated record
Detlef Michelsson
Also filed as: MICHELSSON DETLEF
11 granted patents·7 pending applications·69 citations·filing 2004–2025
89Inventor score
Top patents by PatentIndex Score
18 records- 0183US11182892B2Periodic semiconductor device misregistration metrology system and methodKLA CORP·Filed 2019·Granted Nov 23, 2021·3 cites·20 claims
- 0282US8200004B2Method for inspecting a surface of a wafer with regions of different detection sensitivityMICHELSSON DETLEF·Filed 2008·Granted Jun 12, 2012·9 cites·19 claims
- 0376US7477370B2Method of detecting incomplete edge bead removal from a disk-like objectVISTEC SEMICONDUCTOR SYS GMBH·Filed 2006·Granted Jan 13, 2009·6 cites·11 claims
- 0475US8200003B2Method for the optical inspection and visualization of optical measuring values obtained from disk-like objectsMICHELSSON DETLEF·Filed 2008·Granted Jun 12, 2012·5 cites·14 claims
- 0574US8705837B2Method for inspection and detection of defects on surfaces of disc-shaped objects and computer system with a software product for carrying out the methodMICHELSSON DETLEF·Filed 2011·Granted Apr 22, 2014·4 cites·23 claims
- 0674US7657077B2Detecting defects by three-way die-to-die comparison with false majority determinationVISTEC SEMICONDUCTOR SYS GMBH·Filed 2006·Granted Feb 2, 2010·8 cites·5 claims
- 0770US7193699B2Method and apparatus for scanning a semiconductor waferVISTEC SEMICONDUCTOR SYS GMBH·Filed 2004·Granted Mar 20, 2007·9 cites·17 claims
- 0869US7292328B2Method for inspection of a waferVISTEC SEMICONDUCTOR SYS GMBH·Filed 2004·Granted Nov 6, 2007·8 cites·18 claims
- 0966US7417719B2Method, device and software for the optical inspection of a semi-conductor substrateLEICA MICROSYSTEMS·Filed 2004·Granted Aug 26, 2008·11 cites·27 claims
- 1066US2025271776A1Image modeling-assisted metrologyKLA CORP·Filed 2025·Application pending·0 cites
- 1161US8264534B2Method and apparatus for processing the image data of the surface of a wafer recorded by at least one cameraMICHELSSON DETLEF·Filed 2008·Granted Sep 11, 2012·3 cites·19 claims
- 1249US7973931B2Method for determining the position of the edge bead removal line of a disk-like objectVISTEC SEMICONDUCTOR SYS GMBH·Filed 2008·Granted Jul 5, 2011·3 cites·18 claims
- 1346US2008062415A1Method of optically inspecting and visualizing optical measuring values obtained from disk-like objectsVISTEC SEMICONDUCTOR SYS GMBH·Filed 2007·Application pending·0 cites
- 1445US2004165764A1Method and apparatus for examining semiconductor wafers in a context of die/SAW designLEICA MICROSYSTEMS·Filed 2004·Application pending·0 cites
- 1543US2008249728A1Method for detecting defects on the back side of a semiconductor waferVISTEC SEMICONDUCTOR SYS GMBH·Filed 2008·Application pending·0 cites
- 1640US2006103838A1Method for inspecting a waferLEICA MICROSYSTEMS·Filed 2005·Application pending·0 cites
- 1737US2006240580A1Method for evaluating reproduced images of wafersMICHELSSON DETLEF·Filed 2004·Application pending·0 cites
- 1828US2005008217A1Method for defect segmentation in features on semiconductor substratesLEICA MICROSYSTEMS·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →