Inventor · disambiguated record
Frank Hall
Also filed as: HALL FRANK · HALL FRANK L
20 granted patents·14 pending applications·287 citations·filing 1991–2008
95Inventor score
Top patents by PatentIndex Score
34 records- 0187US7485971B2Electronic device packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·12 cites·38 claims
- 0284US6987058B2Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric materialMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 17, 2006·30 cites·19 claims
- 0384US6969914B2Electronic device packageMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 29, 2005·29 cites·115 claims
- 0482US7642643B2Apparatus for molding a semiconductor die package with enhanced thermal conductivityMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 5, 2010·8 cites·17 claims
- 0582US7498606B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 3, 2009·9 cites·25 claims
- 0682US7268067B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 11, 2007·21 cites·21 claims
- 0781US7276802B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 2, 2007·21 cites·27 claims
- 0880US7084515B2Electronic device packageMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 1, 2006·21 cites·39 claims
- 0979US7262074B2Methods of fabricating underfilled, encapsulated semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 28, 2007·21 cites·20 claims
- 1079US6835592B2Methods for molding a semiconductor die package with enhanced thermal conductivityMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·21 cites·30 claims
- 1178US7468559B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 23, 2008·5 cites·23 claims
- 1275US5072795APressure compensator for drill bit lubrication systemCAMCO INT·Filed 1991·Granted Dec 17, 1991·69 cites·11 claims
- 1371US7342319B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·3 cites·17 claims
- 1468US7851907B2Semiconductor integrated circuit package having electrically disconnected solder balls for mountingMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 14, 2010·2 cites·20 claims
- 1563US7364934B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 29, 2008·9 cites·32 claims
- 1654US8093730B2Underfilled semiconductor die assemblies and methods of forming the sameHALL FRANK L·Filed 2006·Granted Jan 10, 2012·1 cites·26 claims
- 1754US7116000B2Underfilled, encapsulated semiconductor die assemblies and methods of fabricationMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·4 cites·42 claims
- 1850US7417294B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 26, 2008·0 cites·30 claims
- 1950US2005170658A1Methods for preparing ball grid array substrates via use of a laserFiled 2005·Application pending·0 cites
- 2049US7993977B2Method of forming molded standoff structures on integrated circuit devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 9, 2011·0 cites·19 claims
- 2146US2006249493A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 2246US2006249492A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 2346US2006249494A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 2446US2006249495A1Methods for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 2545US7416913B2Methods of manufacturing microelectronic imaging units with discrete standoffsMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 26, 2008·1 cites·44 claims
- 2645US2006113291A1Method for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 2745US2006163573A1Method for preparing ball grid array substrates via use of a laserHALL FRANK L·Filed 2006·Application pending·0 cites
- 2843US2004169024A1Methods for preparing ball grid array substrates via use of a laserFiled 2004·Application pending·0 cites
- 2943US2004170915A1Methods for preparing ball grid array substrates via use of a laserFiled 2004·Application pending·0 cites
- 3042US2004217389A1Apparatus and method for molding a semiconductor die package with enhanced thermal conductivityFiled 2004·Application pending·0 cites
- 3142US2004104206A1Methods for preparing ball grid array substrates via use of a laserFiled 2003·Application pending·0 cites
- 3241US2005253241A1Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assemblyHALL FRANK L·Filed 2005·Application pending·0 cites
- 3341US2005263906A1Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrierHALL FRANK L·Filed 2005·Application pending·0 cites
- 3440US2002170897A1Methods for preparing ball grid array substrates via use of a laserFiled 2001·Application pending·0 cites
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