Inventor · disambiguated record
Eric L. Nikkel
Also filed as: NIKKEL ERIC · NIKKEL ERIC L · NIKKEL ERIC LEE
32 granted patents·2 pending applications·771 citations·filing 2000–2018
97Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO27HEWLETT PACKARD CO2FAASE KENNETH J1LEITH STEVEN D1RIVAS RIO1
Top patents by PatentIndex Score
34 records- 0198US6861277B1Method of forming MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 1, 2005·394 cites·27 claims
- 0295US7508040B2Micro electrical mechanical systems pressure sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Mar 24, 2009·44 cites·21 claims
- 0394US6672712B1Slotted substrates and methods and systems for forming sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 6, 2004·42 cites·27 claims
- 0488US6739199B1Substrate and method of forming substrate for MEMS device with strain gageHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 25, 2004·33 cites·33 claims
- 0587US7199916B2Light modulator deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Apr 3, 2007·28 cites·28 claims
- 0686US7447891B2Light modulator with concentric control-electrode structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 4, 2008·16 cites·34 claims
- 0786US6917459B2MEMS device and method of forming MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 12, 2005·35 cites·56 claims
- 0885US7733553B2Light modulator with tunable optical stateHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 8, 2010·15 cites·25 claims
- 0985US6481831B1Fluid ejection device and method of fabricatingHEWLETT PACKARD CO·Filed 2000·Granted Nov 19, 2002·28 cites·28 claims
- 1080US7079301B2MEMS device and method of forming MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 18, 2006·12 cites·14 claims
- 1179US7273693B2Method for forming a planar mirror using a sacrificial oxideHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 25, 2007·23 cites·8 claims
- 1277US7695104B2Slotted substrates and methods and systems for forming sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Apr 13, 2010·3 cites·19 claims
- 1376US7040735B2Slotted substrates and methods and systems for forming sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 9, 2006·12 cites·17 claims
- 1473US7760197B2Fabry-perot interferometric MEMS electromagnetic wave modulator with zero-electric fieldHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 20, 2010·6 cites·18 claims
- 1573US6419346B1Two-step trench etch for a fully integrated thermal inkjet printheadHEWLETT PACKARD CO·Filed 2001·Granted Jul 16, 2002·13 cites·29 claims
- 1672US8789932B2Printhead and related methods and systemsVAN BROCKLIN ANDREW L·Filed 2010·Granted Jul 29, 2014·3 cites·7 claims
- 1769US8333459B2Printing deviceRIVAS RIO·Filed 2008·Granted Dec 18, 2012·3 cites·20 claims
- 1869US7198726B2Slotted substrates and methods and systems for forming sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 3, 2007·8 cites·25 claims
- 1966US11117376B2Printhead assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Sep 14, 2021·0 cites·5 claims
- 2064US7471441B1FlexuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Dec 30, 2008·3 cites·11 claims
- 2164US6903487B2Micro-mirror device with increased mirror tiltHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jun 7, 2005·12 cites·23 claims
- 2262US7571650B2Piezo resistive pressure sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 11, 2009·2 cites·22 claims
- 2361US6818138B2Slotted substrate and slotting processHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Nov 16, 2004·8 cites·16 claims
- 2460US10195852B2Printhead assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Feb 5, 2019·0 cites·20 claims
- 2560US7874654B2Fluid manifold for fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Jan 25, 2011·2 cites·22 claims
- 2659US7310175B2MEMS device and method of forming MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 18, 2007·9 cites·23 claims
- 2755US6914709B2MEMS device and method of forming MEMS deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 5, 2005·9 cites·31 claims
- 2854US6979585B2Micro-electromechanical systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Dec 27, 2005·5 cites·22 claims
- 2953US10557567B2Fluidic micro electromechanical systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Feb 11, 2020·0 cites·10 claims
- 3053US10342140B2Printed circuit board to molded compound interfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jul 2, 2019·0 cites·15 claims
- 3149US7105456B2Methods for controlling feature dimensions in crystalline substratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 12, 2006·3 cites·16 claims
- 3241US7473649B2Methods for controlling feature dimensions in crystalline substratesLEITH STEVEN D·Filed 2006·Granted Jan 6, 2009·0 cites·22 claims
- 3341US2006203325A1Light Modulator DeviceFAASE KENNETH J·Filed 2006·Application pending·0 cites
- 3436US2002167553A1Two-step trench etch for a fully integrated thermal inkjet printheadFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →