Inventor · disambiguated record
Andrew J. Cobley
Also filed as: COBLEY ANDREW · COBLEY ANDREW J
8 granted patents·8 pending applications·148 citations·filing 2001–2017
88Inventor score
Top patents by PatentIndex Score
16 records- 0192US6911068B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Jun 28, 2005·35 cites·23 claims
- 0290US6773573B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Aug 10, 2004·31 cites·17 claims
- 0390US6736954B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted May 18, 2004·27 cites·31 claims
- 0484US7501014B2Formaldehyde free electroless copper compositionsROHM & HAAS ELECT MAT·Filed 2007·Granted Mar 10, 2009·13 cites·8 claims
- 0583US6652731B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Nov 25, 2003·28 cites·15 claims
- 0680US7527681B2Electroless copper and redox couplesROHM & HAAS ELECT MAT·Filed 2007·Granted May 5, 2009·4 cites·6 claims
- 0778US7611569B2Electroless copper compositionsROHM & HAAS ELECT MAT·Filed 2007·Granted Nov 3, 2009·8 cites·8 claims
- 0874US7858146B2Method of electrolessly depositing metal on the walls of through-holesROHM & HAAS ELECT MAT·Filed 2007·Granted Dec 28, 2010·2 cites·9 claims
- 0954US2005139118A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2004·Application pending·0 cites
- 1050US2004074778A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1149US2005155866A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1246US2020024741A1Material deposition in a magnetic fieldUNIV COVENTRY·Filed 2017·Application pending·0 cites
- 1345US2008038450A1Environmentally friendly electroless copper compositionsROHM & HAAS ELECT MAT·Filed 2007·Application pending·0 cites
- 1442US2004104124A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1541US2003066756A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1638US2004216761A1Desmear and texturing methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →