Inventor · disambiguated record
Mitsutoshi Higashi
Also filed as: HIGASHI MITSUTOSHI
132 granted patents·27 pending applications·2,968 citations·filing 1995–2014
99Inventor score
Top patents by PatentIndex Score
159 records- 0198US6703310B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Mar 9, 2004·211 cites·7 claims
- 0298US5834844ASemiconductor device having an element with circuit pattern thereonSHINKO ELECTRIC IND CO·Filed 1996·Granted Nov 10, 1998·525 cites·10 claims
- 0397US7456497B2Electronic devices and its production methodsSHINKO ELECTRIC IND CO·Filed 2003·Granted Nov 25, 2008·118 cites·6 claims
- 0497US7279771B2Wiring board mounting a capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 9, 2007·86 cites·5 claims
- 0596US7656023B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·37 cites·4 claims
- 0696US6699787B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Mar 2, 2004·119 cites·12 claims
- 0795US8137497B2Method of manufacturing wiring substrateSUNOHARA MASAHIRO·Filed 2009·Granted Mar 20, 2012·38 cites·14 claims
- 0895US7508079B2Circuit substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Mar 24, 2009·41 cites·2 claims
- 0995US7217888B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted May 15, 2007·79 cites·6 claims
- 1095US6980416B2Capacitor, circuit board with built-in capacitor and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Dec 27, 2005·34 cites·13 claims
- 1195US5918113AProcess for producing a semiconductor device using anisotropic conductive adhesiveSHINKO ELECTRIC IND CO·Filed 1997·Granted Jun 29, 1999·200 cites·14 claims
- 1293US7843068B2Semiconductor chip and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 30, 2010·24 cites·5 claims
- 1393US7795140B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 14, 2010·28 cites·12 claims
- 1493US7508057B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 24, 2009·26 cites·10 claims
- 1593US7420128B2Electronic component embedded substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 2, 2008·29 cites·8 claims
- 1692US7025600B2Semiconductor device having external contact terminals and method for using the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Apr 11, 2006·70 cites·3 claims
- 1791US7952191B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted May 31, 2011·22 cites·8 claims
- 1891US6943442B2Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating filmSHINKO ELECTRIC IND CO·Filed 2003·Granted Sep 13, 2005·45 cites·7 claims
- 1991US6678144B2Capacitor, circuit board with built-in capacitor and method for producing the sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Jan 13, 2004·70 cites·36 claims
- 2090US7884632B2Semiconductor inspecting deviceSHINKO ELECTRIC ELECTRIC IND CO LTD·Filed 2009·Granted Feb 8, 2011·29 cites·5 claims
- 2190US7524753B2Semiconductor device having through electrode and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 28, 2009·20 cites·12 claims
- 2290US7507655B2Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 24, 2009·19 cites·5 claims
- 2389US7825423B2Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 2, 2010·17 cites·12 claims
- 2489US7750358B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Jul 6, 2010·15 cites·19 claims
- 2589US5960308AProcess for making a chip sized semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1998·Granted Sep 28, 1999·104 cites·11 claims
- 2688US8080122B2Method of manufacturing wiring substrate and method of manufacturing semiconductor deviceSUNOHARA MASAHIRO·Filed 2009·Granted Dec 20, 2011·12 cites·9 claims
- 2788US7592700B2Semiconductor chip and method of manufacturing semiconductor chipSHINKO ELECTRIC IND CO·Filed 2006·Granted Sep 22, 2009·14 cites·2 claims
- 2888US7057290B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jun 6, 2006·30 cites·6 claims
- 2988US6331679B1Multi-layer circuit board using anisotropic electro-conductive adhesive layerSHINKO ELECTRIC IND CO·Filed 2000·Granted Dec 18, 2001·39 cites·4 claims
- 3088US5777386ASemiconductor device and mount structure thereofSHINKO ELECTRIC IND CO·Filed 1996·Granted Jul 7, 1998·100 cites·15 claims
- 3187US7838897B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 23, 2010·14 cites·6 claims
- 3286US7285862B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 23, 2007·27 cites·4 claims
- 3385US7667474B2Probe deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 23, 2010·9 cites·6 claims
- 3484US9052341B2Probe card and manufacturing method thereofSHIRAISHI AKINORI·Filed 2012·Granted Jun 9, 2015·6 cites·10 claims
- 3584US7488094B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 3684US6861284B2Semiconductor device and production method thereofSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 1, 2005·25 cites·4 claims
- 3783US7981798B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Jul 19, 2011·12 cites·5 claims
- 3883US7573135B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 11, 2009·6 cites·4 claims
- 3983US7494898B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 24, 2009·11 cites·6 claims
- 4083US7054141B2Capacitor, capacitor-embedded board, and method for manufacturing the capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted May 30, 2006·12 cites·13 claims
- 4182US7498200B2Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 3, 2009·7 cites·12 claims
- 4282US6713863B2Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portionSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 30, 2004·29 cites·2 claims
- 4382US6583383B2Method and apparatus for cutting a semiconductor waferSHINKO ELECTRIC IND CO·Filed 2001·Granted Jun 24, 2003·26 cites·7 claims
- 4481US8611389B2Light emitting device and package componentSHIRAISHI AKINORI·Filed 2011·Granted Dec 17, 2013·5 cites·8 claims
- 4581US7745939B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 29, 2010·10 cites·2 claims
- 4680US8368206B2Heat radiation package and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 5, 2013·8 cites·14 claims
- 4780US6538332B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 25, 2003·24 cites·6 claims
- 4880US6404070B1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Jun 11, 2002·31 cites·17 claims
- 4979US8922234B2Probe card and method for manufacturing probe cardSHINKO ELECTRIC IND CO·Filed 2013·Granted Dec 30, 2014·3 cites·4 claims
- 5079US8216884B2Production methods of electronic devicesHIGASHI MITSUTOSHI·Filed 2008·Granted Jul 10, 2012·8 cites·12 claims
Showing the top 50 of 159 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →