Inventor · disambiguated record
Usman Mahmood Chaudhry
Also filed as: CHAUDHRY USMAN · CHAUDHRY USMAN M · CHAUDHRY USMAN MAHMOOD
9 granted patents·4 pending applications·5 citations·filing 2007–2024
79Inventor score
Top patents by PatentIndex Score
13 records- 0177US10892405B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 12, 2021·2 cites·21 claims
- 0276US11495524B2QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making sameTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 8, 2022·2 cites·21 claims
- 0370US11557722B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0470US11538717B2Electronic package for integrated circuits and related methodsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 27, 2022·0 cites·14 claims
- 0569US12087673B2QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making sameTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0660US12374608B2Hybrid chip carrier packageTEXAS INSTRUMENTS INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0759US2025167125A1Build-up film and pre-preg substrates in isolation packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0858US7918018B2Method of fabricating a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2007·Granted Apr 5, 2011·1 cites·10 claims
- 0957US2025246506A1Electronic device with thermally conductive material in semiconductor die trenchTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1054US10861741B2Electronic package for integrated circuits and related methodsTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 8, 2020·0 cites·17 claims
- 1151US2023352387A1Built-In Serial Via Chain for Integrity Monitoring of Laminate SubstrateTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1248US8471155B2Metal plugged substrates with no adhesive between metal and polyimideABBOTT DONALD C·Filed 2011·Granted Jun 25, 2013·0 cites·7 claims
- 1337US2019206741A1Method and structure to eliminate substrate coupling in common drain devicesTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →