Inventor · disambiguated record
Yousuke Moriyama
Also filed as: MORIYAMA YOUSUKE
22 granted patents·1 pending application·24 citations·filing 2010–2023
91Inventor score
Top patents by PatentIndex Score
23 records- 0178US9609743B2Electronic device mounting substrate, electronic apparatus, and imaging moduleKYOCERA CORP·Filed 2014·Granted Mar 28, 2017·4 cites·20 claims
- 0277US8659105B2Wiring substrate, imaging device and imaging device moduleTAKESHITA FUMIAKI·Filed 2010·Granted Feb 25, 2014·9 cites·9 claims
- 0367US12193145B2Substrate for mounting electronic element, electronic device, and electronic module preliminary classKYOCERA CORP·Filed 2023·Granted Jan 7, 2025·0 cites·11 claims
- 0467US12004293B2Substrate for mounting electronic element, electronic device, and electronic moduleKYOCERA CORP·Filed 2023·Granted Jun 4, 2024·0 cites·4 claims
- 0567US9826641B2Electronic device mounting board and electronic apparatusKYOCERA CORP·Filed 2013·Granted Nov 21, 2017·3 cites·8 claims
- 0665US11521912B2Electronic element mounting substrate, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Dec 6, 2022·1 cites·20 claims
- 0765US10249564B2Electronic component mounting substrate, electronic device, and electronic moduleKYOCERA CORP·Filed 2017·Granted Apr 2, 2019·1 cites·11 claims
- 0861US9276023B2Image pickup element housing package, and image pickup deviceKYOCERA CORP·Filed 2012·Granted Mar 1, 2016·1 cites·18 claims
- 0960US11145587B2Electronic component mounting substrate, electronic device, and electronic moduleKYOCERA CORP·Filed 2018·Granted Oct 12, 2021·1 cites·7 claims
- 1058US11570882B2Substrate for mounting electronic element, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Jan 31, 2023·0 cites·18 claims
- 1154US9848491B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2015·Granted Dec 19, 2017·1 cites·10 claims
- 1252US11612056B2Substrate for mounting electronic element, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Mar 21, 2023·0 cites·15 claims
- 1352US9609754B2Package for mounting electronic element, electronic device, and imaging moduleKYOCERA CORP·Filed 2014·Granted Mar 28, 2017·0 cites·12 claims
- 1450US10699993B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Granted Jun 30, 2020·0 cites·8 claims
- 1550US8975535B2Many-up wiring substrate, wiring substrate, and electronic deviceIMAMURA KAZUHITO·Filed 2010·Granted Mar 10, 2015·2 cites·7 claims
- 1649US9872378B2Electronic element mounting board and electronic deviceKYOCERA CORP·Filed 2014·Granted Jan 16, 2018·1 cites·9 claims
- 1747US11784117B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2020·Granted Oct 10, 2023·0 cites·14 claims
- 1842US10319672B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2016·Granted Jun 11, 2019·0 cites·4 claims
- 1941US11024572B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2017·Granted Jun 1, 2021·0 cites·18 claims
- 2040US2021272868A1Electronic element mounting substrate, electronic device, and electronic moduleKYOCERA CORP·Filed 2019·Application pending·0 cites
- 2139US10290591B2Wiring board, electronic device, and electronic moduleKYOCERA CORP·Filed 2016·Granted May 14, 2019·0 cites·15 claims
- 2239US9608020B2Imaging element mounting substrate and imaging deviceKYOCERA CORP·Filed 2014·Granted Mar 28, 2017·0 cites·9 claims
- 2328US9485867B2Wiring boardONITSUKA YURIE·Filed 2011·Granted Nov 1, 2016·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →