Inventor · disambiguated record
Hirofumi Kawai
Also filed as: KAWAI HIROFUMI
9 granted patents·8 pending applications·158 citations·filing 1996–2025
86Inventor score
Top patents by PatentIndex Score
17 records- 0189US6669046B1Food container lid member having selectively peelable areaNISSIN FOOD PRODUCTS LTD·Filed 2001·Granted Dec 30, 2003·66 cites·15 claims
- 0275US12115678B2Control system, control method, robot system, and storage mediumTOSHIBA KK·Filed 2023·Granted Oct 15, 2024·0 cites·13 claims
- 0374US6959832B1Lid member for food containerNISSIN FOOD PRODUCTS LTD·Filed 1999·Granted Nov 1, 2005·50 cites·14 claims
- 0473US9527629B2Steam release standing pouch and content-enclosing standing pouchTOPPAN PRINTING CO LTD·Filed 2014·Granted Dec 27, 2016·3 cites·6 claims
- 0567US11362208B2Semiconductor device having an insulator between source and drain regions and a gate electrode having a portion that covers the insulator and a portion that does not cover the insulatorTOSHIBA KK·Filed 2019·Granted Jun 14, 2022·1 cites·5 claims
- 0664US11660753B2Control system, control method, robot system, and storage mediumTOSHIBA KK·Filed 2020·Granted May 30, 2023·0 cites·14 claims
- 0761US2025318221A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0861US2025366023A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0958US5675173ASemiconductor device having a trench for isolating elements and a trench for applying a potential to a substrateTOSHIBA KK·Filed 1996·Granted Oct 7, 1997·28 cites·6 claims
- 1058US2025022952A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1158US2025366026A1Semiconductor deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1256US2023150138A1Picking system, control device, picking method, and storage mediumTOSHIBA KK·Filed 2022·Application pending·0 cites
- 1354US9776769B2Steam release standing pouch and content-enclosing standing pouchTOPPAN PRINTING CO LTD·Filed 2016·Granted Oct 3, 2017·0 cites·5 claims
- 1454US8777486B2Packaging bag with steam venting function and package using the packaging bagMIYAKE HIDENOBU·Filed 2004·Granted Jul 15, 2014·10 cites·9 claims
- 1551US2023261105A1Semiconductor deviceTOSHIBA KK·Filed 2022·Application pending·0 cites
- 1637US2020091341A1Semiconductor deviceTOSHIBA KK·Filed 2019·Application pending·0 cites
- 1733US2004097049A1Semiconductor device and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →