Inventor · disambiguated record
John C. Malinowski
Also filed as: MALINOWSKI JOHN · MALINOWSKI JOHN C · MALINOWSKI JOHN CHESTER
15 granted patents·5 pending applications·291 citations·filing 1992–2023
94Inventor score
Top patents by PatentIndex Score
20 records- 0194US8563336B2Method for forming thin film resistor and terminal bond pad simultaneouslyCHEN FEN·Filed 2008·Granted Oct 22, 2013·18 cites·16 claims
- 0293US8565510B2Methods for reading a feature pattern from a packaged dieCOHN JOHN M·Filed 2012·Granted Oct 22, 2013·18 cites·10 claims
- 0393US8187897B2Fabricating product chips and die with a feature pattern that contains information relating to the product chipCOHN JOHN M·Filed 2008·Granted May 29, 2012·25 cites·18 claims
- 0483US6656815B2Process for implanting a deep subcollector with self-aligned photo registration marksIBM·Filed 2001·Granted Dec 2, 2003·35 cites·22 claims
- 0583US5204280AProcess for fabricating multiple pillars inside a dram trench for increased capacitor surfaceIBM·Filed 1992·Granted Apr 20, 1993·88 cites·6 claims
- 0682US8729664B2Discontinuous guard ringGAMBINO JEFFREY P·Filed 2012·Granted May 20, 2014·6 cites·9 claims
- 0781US8299609B2Product chips and die with a feature pattern that contains information relating to the product chipCOHN JOHN M·Filed 2012·Granted Oct 30, 2012·4 cites·19 claims
- 0879US7067914B2Dual chip stack method for electro-static discharge protection of integrated circuitsIBM·Filed 2001·Granted Jun 27, 2006·26 cites·33 claims
- 0973US9230921B2Self-healing crack stop structureIBM·Filed 2013·Granted Jan 5, 2016·4 cites·14 claims
- 1071US9287345B2Semiconductor structure with thin film resistor and terminal bond padIBM·Filed 2013·Granted Mar 15, 2016·2 cites·19 claims
- 1168US7053460B2Multi-level RF passive deviceIBM·Filed 2001·Granted May 30, 2006·15 cites·12 claims
- 1267US7025891B2Method of polishing C4 molybdenum masks to remove molybdenum peaksIBM·Filed 2003·Granted Apr 11, 2006·13 cites·13 claims
- 1367US6413868B1Modular high frequency integrated circuit structureIBM·Filed 2001·Granted Jul 2, 2002·13 cites·29 claims
- 1463US2024413603A1Laser chips with a lead frame attachment to a photonics chipGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1558US6259148B1Modular high frequency integrated circuit structureIBM·Filed 1999·Granted Jul 10, 2001·21 cites·16 claims
- 1653US2024079371A1Thermal performance for radio frequency (rf) chip packagesGLOBALFOUNDRIES US INC·Filed 2022·Application pending·0 cites
- 1738US2003197215A1A dual stacked metal-insulator-metal capacitor and method for making sameIBM·Filed 2003·Application pending·0 cites
- 1837US2003146492A1Nitride etchstop film to protect metal-insulator-metal capacitor dielectric from degradation and method for making sameIBM·Filed 2002·Application pending·0 cites
- 1935US2002163062A1Multiple material stacks with a stress relief layer between a metal structure and a passivation layerIBM·Filed 2001·Application pending·0 cites
- 2033US6656375B1Selective nitride: oxide anisotropic etch processIBM·Filed 1998·Granted Dec 2, 2003·3 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →