Inventor · disambiguated record
Charles M. Watkins
Also filed as: WATKINS CHARLES · WATKINS CHARLES M · WATKINS CHARLES MARTIN
124 granted patents·12 pending applications·2,048 citations·filing 1995–2024
99Inventor score
Files withMICRON TECHNOLOGY INC105MICRON DISPLAY TECH INC12WATKINS CHARLES M8FARNWORTH WARREN M3APTINA IMAGING CORP2
Top patents by PatentIndex Score
136 records- 0198US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 0298US6906418B2Semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 14, 2005·140 cites·29 claims
- 0397US11688842B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 27, 2023·2 cites·20 claims
- 0497US8384105B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2010·Granted Feb 26, 2013·23 cites·12 claims
- 0597US7759800B2Microelectronics devices, having vias, and packaged microelectronic devices having viasMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 20, 2010·51 cites·22 claims
- 0697US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 0797US7157310B2Methods for packaging microfeature devices and microfeature devices formed by such methodsMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 2, 2007·99 cites·35 claims
- 0897US7091124B2Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 15, 2006·114 cites·26 claims
- 0996US6803303B1Method of fabricating semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 12, 2004·80 cites·47 claims
- 1095US9748461B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 29, 2017·8 cites·6 claims
- 1195US7956443B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 7, 2011·16 cites·17 claims
- 1294US6172456B1Field emission displayMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 9, 2001·75 cites·26 claims
- 1393US6127777AField emission display with non-evaporable getter materialMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 3, 2000·60 cites·14 claims
- 1493US6054808ADisplay device with grille having getter materialMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 25, 2000·59 cites·6 claims
- 1592US11239403B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 1, 2022·4 cites·12 claims
- 1692US8420415B2Method for forming a light conversion materialWATKINS CHARLES M·Filed 2010·Granted Apr 16, 2013·8 cites·32 claims
- 1792US7598167B2Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 6, 2009·20 cites·29 claims
- 1892US6509677B2Focusing electrode and method for field emission displaysMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 21, 2003·30 cites·6 claims
- 1992US5827102ALow temperature method for evacuating and sealing field emission displaysMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 27, 1998·77 cites·16 claims
- 2092US5789859AField emission display with non-evaporable getter materialMICRON DISPLAY TECH INC·Filed 1996·Granted Aug 4, 1998·58 cites·10 claims
- 2191US10403805B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·4 cites·4 claims
- 2291US9236550B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2013·Granted Jan 12, 2016·7 cites·20 claims
- 2391US7413979B2Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 19, 2008·16 cites·27 claims
- 2490US7629250B2Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 8, 2009·16 cites·30 claims
- 2588US6400075B2Faceplate for field emission displayMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·16 cites·22 claims
- 2688US2024339582A1Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2787US2023420602A1Microelectronic workpiece processing systems and associated methods of color correctionMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2886US8669179B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 11, 2014·5 cites·13 claims
- 2985US12015114B2Light emitting diodes with enhanced thermal sinking and associated methods of operationMICRON TECHNOLOGY INC·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 3085US8502353B2Through-wafer interconnects for photoimager and memory wafersAKRAM SALMAN·Filed 2011·Granted Aug 6, 2013·5 cites·11 claims
- 3185US7115961B2Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·33 cites·44 claims
- 3285US5795206AFiber spacers in large area vacuum displays and method for manufacture of sameMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 18, 1998·34 cites·47 claims
- 3384US7419841B2Microelectronic imagers and methods of packaging microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 2, 2008·10 cites·25 claims
- 3484US6255769B1Field emission displays with raised conductive features at bonding locations and methods of forming the raised conductive featuresMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 3, 2001·20 cites·27 claims
- 3583US7858429B2Packaged microelectronic imagers and methods of packaging microelectronic imagersROUND ROCK RES LLC·Filed 2007·Granted Dec 28, 2010·8 cites·34 claims
- 3683US7265330B2Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 4, 2007·8 cites·28 claims
- 3783US5766053AInternal plate flat-panel field emission displayMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 16, 1998·33 cites·27 claims
- 3882US8273589B2Light emitting diodes and methods for manufacturing light emitting diodesWATKINS CHARLES M·Filed 2010·Granted Sep 25, 2012·3 cites·17 claims
- 3982US7341881B2Methods of packaging and testing microelectronic imaging devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·9 cites·20 claims
- 4082US5807154AProcess for aligning and sealing field emission displaysMICRON DISPLAY TECH INC·Filed 1995·Granted Sep 15, 1998·32 cites·34 claims
- 4181US7199439B2Microelectronic imagers and methods of packaging microelectronic imagersMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 3, 2007·24 cites·31 claims
- 4280US8847198B2Light emitting devices with built-in chromaticity conversion and methods of manufacturingBASCERI CEM·Filed 2011·Granted Sep 30, 2014·2 cites·25 claims
- 4380US7488618B2Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the sameMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 10, 2009·6 cites·20 claims
- 4480US5931713ADisplay device with grille having getter materialMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 3, 1999·26 cites·30 claims
- 4579US8969899B2Method for forming a light conversion materialMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 3, 2015·2 cites·22 claims
- 4679US7855140B2Method of forming vias in semiconductor substrates and resulting structuresMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 21, 2010·6 cites·18 claims
- 4779US7498240B2Microfeature workpieces, carriers, and associated methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 3, 2009·6 cites·27 claims
- 4879US7094117B2Electrical contacts with dielectric coresMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·19 cites·60 claims
- 4978US11757061B2Microelectronic workpiece processing systems and associated methods of color correctionMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 12, 2023·0 cites·18 claims
- 5078US9530927B2Light emitting devices with built-in chromaticity conversion and methods of manufacturingMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 27, 2016·1 cites·16 claims
Showing the top 50 of 136 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →