Inventor · disambiguated record
Hwanpil Park
Also filed as: PARK HWANPIL
8 granted patents·3 pending applications·11 citations·filing 2016–2024
77Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0193US12033924B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
- 0290US10847435B2Semiconductor package structure and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 24, 2020·9 cites·20 claims
- 0379US12136581B2Semiconductor package structure and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 5, 2024·0 cites·10 claims
- 0473US2024321701A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0571US11842941B2Semiconductor package structure and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·9 claims
- 0668US11315851B2Semiconductor package structure and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 0765US12261093B2Semiconductor packages having a dam structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·19 claims
- 0859US11437293B2Semiconductor packages having a dam structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·19 claims
- 0957US11776913B2Semiconductor package and a package-on-package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1051US2023114274A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1148US2023110126A1Semiconductor packages having a package substrate and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →