Inventor · disambiguated record
Michitoshi Arata
Also filed as: ARATA MICHITOSHI
9 granted patents·3 pending applications·108 citations·filing 1996–2021
88Inventor score
Top patents by PatentIndex Score
12 records- 0181US6696155B1Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 1996·Granted Feb 24, 2004·34 cites·59 claims
- 0278US7208539B2Thermosetting resin composition, and prepreg and laminated board using the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Apr 24, 2007·15 cites·16 claims
- 0377US6572968B2Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 3, 2003·11 cites·59 claims
- 0461US2024026118A1Molding resin composition and electronic component deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0561US2023092703A1Resin composition for molding and electronic component apparatusSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0660US6329474B1Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazoleHITACHI CHEMICAL CO LTD·Filed 2000·Granted Dec 11, 2001·10 cites·18 claims
- 0756US6558797B1Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted May 6, 2003·16 cites·5 claims
- 0851US6462147B1Epoxy resin compositions for printed circuit board and printed circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Oct 8, 2002·10 cites·13 claims
- 0949US6692792B2Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 2003·Granted Feb 17, 2004·0 cites·15 claims
- 1042US2024034833A1Resin composition for molding and electronic component deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1138US6214468B1Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Apr 10, 2001·7 cites·11 claims
- 1235US6180250B1Epoxy composition for printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jan 30, 2001·5 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →