Inventor · disambiguated record
Takao Ikezawa
Also filed as: IKEZAWA TAKAO
5 granted patents·4 pending applications·41 citations·filing 2006–2024
76Inventor score
Top patents by PatentIndex Score
9 records- 0188US8420446B2Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit memberYO SHIMAZAKI·Filed 2011·Granted Apr 16, 2013·22 cites·11 claims
- 0287US8739401B2Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit memberSHIMAZAKI YO·Filed 2010·Granted Jun 3, 2014·12 cites·7 claims
- 0375US8742554B2Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit memberSHIMAZAKI YO·Filed 2006·Granted Jun 3, 2014·7 cites·15 claims
- 0463US12174494B2Light control member and light control deviceDAINIPPON PRINTING CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·14 claims
- 0556US2025199366A1Light control member and light control deviceDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0654US11619839B2Method for manufacturing laminated glass, laminated glass and light control filmDAINIPPON PRINTING CO LTD·Filed 2018·Granted Apr 4, 2023·0 cites·5 claims
- 0752US2024059049A1Light modulating device, manufacturing method therefor, and liquid crystal deviceDAINIPPON PRINTING CO LTD·Filed 2021·Application pending·0 cites
- 0846US2009146280A1Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit memberDAINIPPON PRINTING CO LTD·Filed 2006·Application pending·0 cites
- 0943US2025010587A1Laminated glass and liquid crystal deviceDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →