Inventor · disambiguated record
Jeng-Shiou Chen
Also filed as: CHEN JENG-SHIOU
22 granted patents·1 pending application·37 citations·filing 2013–2024
93Inventor score
Top patents by PatentIndex Score
23 records- 0194US10714383B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·6 cites·20 claims
- 0288US9892960B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·4 cites·20 claims
- 0388US9153479B2Method of preventing a pattern collapseTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·7 cites·21 claims
- 0486US11961761B2Mitigating pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·1 cites·20 claims
- 0586US9401329B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 26, 2016·5 cites·19 claims
- 0684US9502287B2Method of preventing pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·3 cites·20 claims
- 0783US10290538B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·2 cites·20 claims
- 0882US2024258163A1Mitigating pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0976US9373541B2Hard mask removal schemeTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 1076US8957006B2Cleaning solution comprising an ether acetate for preventing pattern collapseTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 17, 2015·3 cites·16 claims
- 1175US11682580B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1275US9412650B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·2 cites·20 claims
- 1373US10043706B2Mitigating pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 7, 2018·2 cites·17 claims
- 1472US11088021B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 10, 2021·0 cites·20 claims
- 1572US10985054B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·0 cites·20 claims
- 1664US11043453B2Method of preventing pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 1764US10679895B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 1860US10950495B2Mitigating pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·20 claims
- 1957US10115630B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·0 cites·20 claims
- 2056US10515895B2Method of preventing pattern collapseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·20 claims
- 2154US9142450B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
- 2252US9397047B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 2352US9142452B2Hard mask removal schemeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →